公开(公告)号：US20230216170A1

公开(公告)日：2023-07-06

申请号：US18072516

申请日：2022-11-30

Applicant: Raytheon Company

Inventor： James Benedict ,  Lawrence A. Binek ,  Erika Klek

IPC: H01P3/18 ,  H01P3/20 ,  H01P11/00 ,  H01P5/20

CPC classification number: H01P3/18 ,  H01P3/20 ,  H01P5/20 ,  H01P11/001

Abstract: A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

公开(公告)号：US11145977B2

公开(公告)日：2021-10-12

申请号：US16441837

申请日：2019-06-14

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Jonathan E. Nufio-Molina ,  Phillip W. Thiessen ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Erika Klek

IPC: H01Q1/12 ,  H01Q25/00 ,  H01Q21/00 ,  H01P1/04 ,  H01Q3/30 ,  H05K1/02

Abstract: An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

公开(公告)号：US20240305011A1

公开(公告)日：2024-09-12

申请号：US18668328

申请日：2024-05-20

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/00 ,  H01Q21/24 ,  H05K1/02

CPC classification number: H01Q21/0025 ,  H01Q21/24 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20230216166A1

公开(公告)日：2023-07-06

申请号：US18072539

申请日：2022-11-30

Applicant: Raytheon Company

Inventor： James Benedict ,  Lawrence A. Binek ,  Erika Klek

IPC: H01P1/208 ,  H01P11/00 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y30/00 ,  B29C64/245 ,  B29C64/336

CPC classification number: H01P1/2088 ,  H01P11/007 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y30/00 ,  B29C64/245 ,  B29C64/336 ,  B29L2011/0075

Abstract: A radio frequency (RF) waveguide comprising a channel, a filter, and a support bridge. The channel can comprise an outer wall defining an inner cavity configured to propagate electromagnetic waves. The filter can be disposed in the inner cavity of the channel and can comprise a perimeter edge and an aperture. The support bridge can comprise a first interface connected to an inner surface of the outer wall at a first location, and a second interface connected to the filter at a position between the perimeter edge and the aperture of the filter to support the filter within the channel. The support bridge can remain in place as connected to the filter, and the filter and waveguide can operate without interference from the support bridge, meaning that the waveguide meets all performance specifications and functions as intended for a particular application even with the support bridge left in place.

公开(公告)号：US11444365B2

公开(公告)日：2022-09-13

申请号：US16822399

申请日：2020-03-18

Applicant: RAYTHEON COMPANY

Inventor： James Benedict ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC: H01P5/08 ,  H01P3/08

Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US11990677B2

公开(公告)日：2024-05-21

申请号：US17200155

申请日：2021-03-12

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/00 ,  H01Q21/24 ,  H05K1/02

CPC classification number: H01Q21/0025 ,  H01Q21/24 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20220294123A1

公开(公告)日：2022-09-15

申请号：US17200155

申请日：2021-03-12

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/06 ,  H05K1/02

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20220254750A1

公开(公告)日：2022-08-11

申请号：US17169098

申请日：2021-02-05

Applicant: Raytheon Company

Inventor： Patrick E. Boyle ,  James E. Benedict ,  Erika Klek ,  Mikhail Pevzner

IPC: H01L23/00

Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.

公开(公告)号：US11317502B2

公开(公告)日：2022-04-26

申请号：US16874794

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  William J. Clark ,  Channing P. Favreau ,  Erika Klek ,  Mikhail Pevzner ,  Donald G. Hersey ,  Gregory G. Beninati ,  Thomas J. Tellinghuisen

IPC: H05K1/00 ,  H05K1/02 ,  H01P1/20 ,  H05K7/14

Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

公开(公告)号：US20210360772A1

公开(公告)日：2021-11-18

申请号：US16874794

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  William J. Clark ,  Channing P. Favreau ,  Erika Klek ,  Mikhail Pevzner ,  Donald G. Hersey ,  Gregory G. Beninati ,  Thomas J. Tellinghuisen

IPC: H05K1/02 ,  H05K7/14 ,  H01P1/20

Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.