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公开(公告)号：US20190148837A1
公开(公告)日：2019-05-16
申请号：US16180936
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： John P. Haven , Thomas V. Sikina , Peter J. Adams , James E. Benedict
Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.
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公开(公告)号：US11581652B2
公开(公告)日：2023-02-14
申请号：US17578034
申请日：2022-01-18
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US11121474B2
公开(公告)日：2021-09-14
申请号：US16180936
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： John P. Haven , Thomas V. Sikina , Peter J. Adams , James E. Benedict
IPC: H01Q1/24 , H01Q21/00 , H01P1/04 , H01Q13/10 , H01Q13/18 , H05K1/02 , H05K3/40 , H01P5/02 , H01Q1/52 , H01Q17/00 , H01Q1/42 , H01Q1/44 , B33Y10/00 , B33Y70/00 , B33Y80/00
Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.
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公开(公告)号：US11569574B2
公开(公告)日：2023-01-31
申请号：US16418231
申请日：2019-05-21
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , John P. Haven , Peter J. Adams , Thomas V. Sikina
Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
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公开(公告)号：US20190148832A1
公开(公告)日：2019-05-16
申请号：US16180822
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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Patent Agency Ranking
公开(公告)号：US11432408B2
公开(公告)日：2022-08-30
申请号：US16414112
申请日：2019-05-16
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , John P. Haven , Peter J. Adams , James E. Benedict , Carolyn R. Reistad
Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.
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公开(公告)号：US20200028257A1
公开(公告)日：2020-01-23
申请号：US16418231
申请日：2019-05-21
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , John P. Haven , Peter J. Adams , Thomas V. Sikina
Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
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公开(公告)号：US20190357363A1
公开(公告)日：2019-11-21
申请号：US16414112
申请日：2019-05-16
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , John P. Haven , Peter J. Adams , James E. Benedict , Carolyn R. Reistad
Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.
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公开(公告)号：US20220140485A1
公开(公告)日：2022-05-05
申请号：US17578034
申请日：2022-01-18
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US11289814B2
公开(公告)日：2022-03-29
申请号：US16180822
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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