公开(公告)号：US3836825A

公开(公告)日：1974-09-17

申请号：US29553672

申请日：1972-10-06

Applicant: RCA CORP

Inventor： HALL W ,  KOSKULITZ J

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/16 ,  H01L23/28 ,  H01L23/367 ,  H01L23/42 ,  H01L23/433 ,  H01L1/12

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/16 ,  H01L23/367 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An integrated circuit chip having circuit elements capable of relatively high power operation is encapsulated in a body of polymeric material having the form of an elongated prism. Conductors are electrically coupled to the circuit elements in the chip and extend outwardly of the body through a relatively long side thereof. A heat conducting stud is anchored in the body and is thermally coupled to the chip. The stud extends outwardly of the package through another of its relatively long sides. A heat sink may be coupled to the stud outside of the package.

Abstract translation: 具有能够相对高功率操作的电路元件的集成电路芯片被封装在具有细长棱镜形式的聚合材料体中。 导体电耦合到芯片中的电路元件，并通过其相对较长的一侧向外延伸。 导热柱被锚定在主体中并且热耦合到芯片。 螺柱通过其相对长的侧面中的另一个延伸到包装外面。 散热器可以联接到包装外部的螺柱。