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1.
公开(公告)号:US20170322319A1
公开(公告)日:2017-11-09
申请号:US15144861
申请日:2016-05-03
发明人: Kris INIEWSKI , Glenn BINDLEY
摘要: Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.
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公开(公告)号:US20190339402A1
公开(公告)日:2019-11-07
申请号:US15972717
申请日:2018-05-07
摘要: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.
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3.
公开(公告)号:US20170290555A1
公开(公告)日:2017-10-12
申请号:US15095786
申请日:2016-04-11
申请人: REDLEN TECHNOLOGIES
发明人: Kris INIEWSKI , Glenn BINDLEY , Robert CRESTANI
CPC分类号: H01L27/14609 , A61B6/032 , A61B6/4233 , A61B6/482 , G01N2223/304 , G01N2223/401 , G01T1/1663 , G01T1/246 , G01T1/247 , G01T1/2985 , G06T1/60 , G06T2207/10081 , H01L27/14676 , H01L2225/06513 , H03K5/135 , H03K19/17716 , H03K23/40
摘要: A detector slice circuit for a CT imaging system may include a plurality of sensors for detecting photons passing through an object and a first electronic component configured to determine an energy of photons detected by the plurality of sensors and generate photon count data, which may be a count of detected photons in one or more energy bins. The detector slice circuit may further include a second electronic component configured to receive the photon count data from the first electronic component and is clocked at a first clock rate; a local memory storage configured to receive the photon count data from the second electronic component at the first clock rate and to output the photon count data at a second clock rate.
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