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公开(公告)号：US20200083663A1
公开(公告)日：2020-03-12
申请号：US16544363
申请日：2019-08-19
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Kazuaki TSUCHIYAMA , Motoo SUWA , Hidemasa TAKAHASHI
Abstract: Improve semiconductor device performance. The wiring WL1A on which the semiconductor chip CHP1 in which the semiconductor lasers LD is formed is mounted has a stub STB2 in the vicinity of the mounting area of the semiconductor chip CHP1.
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