SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20230065171A1

    公开(公告)日:2023-03-02

    申请号:US17887184

    申请日:2022-08-12

    Abstract: A semiconductor device includes a first semiconductor chip in which a first multilayer wiring structure including a first coil and a second coil is formed and a second semiconductor chip in which a second multilayer wiring structure including a third coil and a fourth coil is formed. The second semiconductor chip is joined to the first semiconductor chip such that the first coil (second coil) and the third coil (fourth coil) are overlapped and the second semiconductor chip does not have an offset structure with respect to the first semiconductor chip. The second semiconductor chip is joined to the first semiconductor chip such that it is not overlapped with a pad for the first semiconductor chip and a pad for the second semiconductor chip.

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