公开(公告)号：US10541216B2

公开(公告)日：2020-01-21

申请号：US16175522

申请日：2018-10-30

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Kazuyuki Nakagawa ,  Keita Tsuchiya ,  Yoshiaki Sato ,  Shuuichi Kariyazaki ,  Norio Chujo ,  Masayoshi Yagyu ,  Yutaka Uematsu

IPC分类号： H01L27/146 ,  H01L23/66 ,  H01L23/538 ,  H01L23/367 ,  H01L23/00

摘要： A semiconductor device includes a semiconductor chip mounted over a wiring substrate. A signal wiring for input for transmitting input signals to the semiconductor chip and a signal wiring for output for transmitting output signals from the semiconductor chip are placed in different wiring layers in the wiring substrate and overlap with each other. In the direction of thickness of the wiring substrate, each of the signal wirings is sandwiched between conductor planes supplied with reference potential. In the front surface of the semiconductor chip, a signal electrode for input and a signal electrode for output are disposed in different rows. In cases where the signal wiring for output is located in a layer higher than the signal wiring for input in the wiring substrate, the signal electrode for output is placed in a row closer to the outer edge of the front surface than the signal electrode for input.

公开(公告)号：US10763214B2

公开(公告)日：2020-09-01

申请号：US16405644

申请日：2019-05-07

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Shuuichi Kariyazaki ,  Kazuyuki Nakagawa ,  Keita Tsuchiya ,  Yosuke Katsura ,  Shinji Katayama ,  Norio Chujo ,  Masayoshi Yagyu ,  Yutaka Uematsu

IPC分类号： H01L23/538 ,  H01L23/66 ,  H01L23/498 ,  H05K1/02 ,  H04L25/02

摘要： Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.