公开(公告)号：US12104009B2

公开(公告)日：2024-10-01

申请号：US16971307

申请日：2018-02-22

申请人： RESONAC CORPORATION

发明人： Kazumasa Fukuda ,  Yoshitaka Takezawa ,  Tomoko Higashiuchi ,  Naoki Maruyama ,  Shingo Tanaka

IPC分类号： C08G59/24 ,  C08G59/22 ,  C08G59/28 ,  C08J5/04 ,  C08K5/00 ,  C08L63/00 ,  C08L63/02

CPC分类号： C08G59/226 ,  C08G59/245 ,  C08G59/28 ,  C08J5/04 ,  C08K5/0025 ,  C08G2250/00

摘要： (1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

公开(公告)号：US11919995B2

公开(公告)日：2024-03-05

申请号：US16970955

申请日：2019-02-18

申请人： RESONAC CORPORATION

发明人： Naoki Maruyama ,  Tomoko Higashiuchi ,  Kazumasa Fukuda ,  Hideyuki Katagi ,  Yuki Nakamura ,  Yoshitaka Takezawa

IPC分类号： C08G59/24 ,  C08G59/28 ,  C08G59/30 ,  C08G59/50 ,  C08K3/04 ,  C08L63/00 ,  B32B27/38 ,  C08J5/24

CPC分类号： C08G59/245 ,  C08G59/5033 ,  C08K3/04

摘要： An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.