公开(公告)号：US20150201515A1

公开(公告)日：2015-07-16

申请号：US14595615

申请日：2015-01-13

Applicant: RF Micro Devices, Inc.

Inventor： Donald Joseph Leahy ,  Jungwoo Lee ,  John August Orlowski ,  Howard Joseph Holyoak

IPC: H05K7/06 ,  H05K13/00 ,  H05K1/09

CPC classification number: H01L23/49811 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/81444 ,  H01L2224/85444 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/181 ,  H05K1/09 ,  H05K3/244 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0338 ,  H05K2201/10674 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49162 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronics module includes a non-conductive body, a first set of conductive features exposed on a surface of the non-conductive body, and a second set of conductive features exposed on the surface of the non-conductive body. The first set of conductive features is configured to connect to a wire bond component. The second set of conductive features is configured to connect to a flip chip component. A protective finish is provided over each one of the first set of conductive features and the second set of conductive features. The protective finish includes a layer of nickel less than 1 μm thick, a layer of palladium over the layer of nickel, and a layer of gold over the layer of palladium.

Abstract translation: 电子模块包括非导电体，暴露在非导电体的表面上的第一组导电特征，以及暴露在非导电体的表面上的第二组导电特征。 第一组导电特征被配置成连接到引线接合部件。 第二组导电特征被配置为连接到倒装芯片部件。 在第一组导电特征和第二组导电特征中的每一个上提供保护整理。 保护层包括一层厚度小于1μm的镍层，镍层上的一层钯层和钯层上的一层金。