公开(公告)号：US20160005674A1

公开(公告)日：2016-01-07

申请号：US14520354

申请日：2014-10-22

Applicant: RICHTEK TECHNOLOGY CORP

Inventor： Ya Tzu WU ,  Yu Lin Yang

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13082 ,  H01L2224/1403 ,  H01L2224/14519 ,  H01L2224/16245 ,  H01L2224/171 ,  H01L2224/17519 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/00012

Abstract: An integrated circuit packaging structure includes a chip, an electrical bump, a heat dissipation bump, a lead frame, and a sealant. The chip includes an active surface and an electronic component that is formed by using a semiconductor process. The electrical bump is electrically connected to the electronic component through the active surface. The heat dissipation bump is connected to the active surface. The lead frame is electrically connected to the electrical bump. The sealant covers the chip, the lead frame, and the electrical bump, wherein the heat dissipation bump and a part of the lead frame are exposed without being covered. The height of the heat dissipation bump relative to the active surface is unequal to that of the electrical bump relative to the active surface.

Abstract translation: 集成电路封装结构包括芯片，电凸起，散热凸块，引线框架和密封剂。 芯片包括通过使用半导体工艺形成的有源表面和电子元件。 电气凸块通过有源表面电连接到电子部件。 散热凸块连接到有源表面。 引线框架电连接到电气凸块。 密封剂覆盖芯片，引线框架和电气凸块，其中散热凸块和引线框架的一部分在不被覆盖的情况下暴露。 散热凸块相对于活性表面的高度与电凸起相对于活性表面的高度不等同。