公开(公告)号：US20180062059A1

公开(公告)日：2018-03-01

申请号：US15673959

申请日：2017-08-10

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Masashi KICHIMA

IPC分类号： H01L33/64 ,  H01L33/50 ,  H01L33/62 ,  H01L23/00 ,  F21V29/76 ,  F21S8/10 ,  F21V23/06

CPC分类号： H01L33/647 ,  F21S41/141 ,  F21S41/19 ,  F21S41/192 ,  F21S45/43 ,  F21S45/47 ,  F21V23/06 ,  F21V29/70 ,  F21V29/76 ,  F21V29/763 ,  F21Y2115/10 ,  H01L24/16 ,  H01L24/17 ,  H01L33/502 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/14519 ,  H01L2224/73265 ,  H01L2924/12041 ,  H05K1/0204 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10416

摘要： A light-emitting module is provided. The light-emitting module includes an insulating substrate. The insulating substrate includes a mounting surface, a rear surface, and a through hole that passes from the mounting surface to the rear surface. A light-emitting element is on the mounting surface. A thermal conductor is disposed in the through hole in contact with an inner wall of the insulating substrate defined by the through hole. The thermal conductor includes a mounting-side end face thermally connected to the light-emitting element, a rear-side end face, and a displacement suppressing portion that suppresses displacement of the thermal conductor in a direction from the rear surface to the mounting surface. thermal conductor. The rear-side end, in a cross-section parallel to the rear surface of the insulating surface, is larger in surface area than the mounting-side end, in a cross-section parallel to the mounting surface of the insulating substrate.

公开(公告)号：US20180061730A1

公开(公告)日：2018-03-01

申请号：US15364752

申请日：2016-11-30

申请人： Qorvo US, Inc.

发明人： Kevin J. Anderson ,  Anthony Chiu ,  Tarak A. Railkar

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/373 ,  H01L23/66

CPC分类号： H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2224/1403 ,  H01L2224/14519 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32235 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： The present disclosure relates to an air-cavity package, which includes a substrate, a base, and a semiconductor die. The substrate includes a substrate body, thermal vias extending through the substrate body, and a metal trace on a bottom side of the substrate body and separate from the thermal vias. The base includes a base body, a perimeter wall extending about a perimeter of the base body, and a signal via structure. Herein, the bottom side of the substrate body resides on the perimeter wall to form a cavity, and the signal via structure extends through the perimeter wall and is electrically coupled to the metal trace. The semiconductor die is mounted on the bottom side of the substrate body, exposed to the cavity, and electrically coupled to the metal trace. The thermal vias conduct heat generated from the semiconductor die toward a top side of the substrate body.

公开(公告)号：US20140021603A1

公开(公告)日：2014-01-23

申请号：US13948516

申请日：2013-07-23

申请人： RF Micro Devices, Inc.

发明人： Thomas Scott Morris ,  Michael Meeder

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/14 ,  H01L21/76885 ,  H01L23/3192 ,  H01L23/367 ,  H01L23/4824 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02206 ,  H01L2224/02215 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/14519 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/01047 ,  H01L2924/00

摘要： A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed. The first passivation layer is over the first semiconductor device, which includes a first group of device fingers. The first interconnect bump is thermally and electrically connected to each of the first group of device fingers. Additionally, the first interconnect bump protrudes through a first opening in the first passivation layer.

摘要翻译： 公开了一种包括第一半导体器件，第一钝化层和第一互连凸点的半导体管芯。 第一钝化层在第一半导体器件之上，其包括第一组器件指状物。 第一互连凸块被热电连接到第一组设备手指中的每一个。 另外，第一互连凸块突出穿过第一钝化层中的第一开口。

公开(公告)号：US20120092832A1

公开(公告)日：2012-04-19

申请号：US12907522

申请日：2010-10-19

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K7/20

CPC分类号： H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

摘要翻译： 微电子组件包括具有相对面对的第一和第二表面的介电元件和在表面之间延伸的一个或多个孔，该介电元件还在其上具有导电元件; 第一微电子元件，其具有背面和面向电介质元件的第一表面的前表面，第一微电子元件具有第一边缘和暴露在其前表面的多个触点; 第二微电子元件，包括具有背面和面向第一微电子元件的后表面的前表面，第二微电子元件的前表面的突出部分延伸超过第一微电子元件的第一边缘，突出部分为 与介电元件的第一表面间隔开，第二微电子元件具有在前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件或第二微电子元件中的至少一个的散热器。

公开(公告)号：US20170229412A1

公开(公告)日：2017-08-10

申请号：US15494942

申请日：2017-04-24

申请人： Samsung Electronics Co., Ltd.

发明人： Sun-kyoung SEO ,  Seung-kwan RYU ,  Cha-jea JO ,  Tae-Je CHO

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L25/065

CPC分类号： H01L24/14 ,  H01L23/481 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13026 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/1415 ,  H01L2224/14181 ,  H01L2224/14519 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00014

摘要： The semiconductor chip including a semiconductor device layer including a pad region and a cell region, a plurality of uppermost wirings formed on the semiconductor device layer to be arranged at an equal distance in the cell region, a passivation layer formed in the cell region and the pad region, and a plurality of thermal bumps disposed on the passivation layer to be electrically insulated from the plurality of uppermost wirings may be provided. The semiconductor device layer may include a plurality of through silicon via (TSV) structures in the pad region. The plurality of uppermost wirings may extend in parallel along one direction and have a same width. The passivation layer may cover at least a top surface of the plurality of uppermost wirings in the cell region and includes a top surface having a wave shape.

公开(公告)号：US20170018520A1

公开(公告)日：2017-01-19

申请号：US15278960

申请日：2016-09-28

申请人： Qorvo US, Inc.

发明人： Thomas Scott Morris ,  Michael Meeder

IPC分类号： H01L23/00

CPC分类号： H01L24/14 ,  H01L21/76885 ,  H01L23/3192 ,  H01L23/367 ,  H01L23/4824 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02206 ,  H01L2224/02215 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/14519 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/01047 ,  H01L2924/00

摘要： A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed. The first passivation layer is over the first semiconductor device, which includes a first group of device fingers. The first interconnect bump is thermally and electrically connected to each of the first group of device fingers. Additionally, the first interconnect bump protrudes through a first opening in the first passivation layer.

摘要翻译： 公开了一种包括第一半导体器件，第一钝化层和第一互连凸点的半导体管芯。 第一钝化层在第一半导体器件之上，其包括第一组器件指状物。 第一互连凸块被热电连接到第一组设备手指中的每一个。 另外，第一互连凸块突出穿过第一钝化层中的第一开口。

公开(公告)号：US09418954B2

公开(公告)日：2016-08-16

申请号：US14659680

申请日：2015-03-17

申请人： STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

发明人： Pierre Bar ,  Alisee Taluy ,  Olga Kokshagina

IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/3213 ,  H01L21/56 ,  H01L21/768 ,  H01L23/36 ,  H01L21/48

CPC分类号： H01L23/3675 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76897 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14519 ,  H01L2224/29013 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/3015 ,  H01L2224/30519 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.

摘要翻译： 一种装置包括组装在插入器上的芯片。 电绝缘层在芯片周围涂覆插入件的上表面。 第一金属线在插入件的上表面上延伸并且布置在与芯片连接的导电元件之间。 每个第一金属线的端部被布置成延伸超过芯片在插入件上的投影。 导热通孔将第一金属线的端部连接到支撑在设备的上表面处的散热器。

公开(公告)号：US20160005674A1

公开(公告)日：2016-01-07

申请号：US14520354

申请日：2014-10-22

申请人： RICHTEK TECHNOLOGY CORP

发明人： Ya Tzu WU ,  Yu Lin Yang

IPC分类号： H01L23/367 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/367 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13082 ,  H01L2224/1403 ,  H01L2224/14519 ,  H01L2224/16245 ,  H01L2224/171 ,  H01L2224/17519 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/00012

摘要： An integrated circuit packaging structure includes a chip, an electrical bump, a heat dissipation bump, a lead frame, and a sealant. The chip includes an active surface and an electronic component that is formed by using a semiconductor process. The electrical bump is electrically connected to the electronic component through the active surface. The heat dissipation bump is connected to the active surface. The lead frame is electrically connected to the electrical bump. The sealant covers the chip, the lead frame, and the electrical bump, wherein the heat dissipation bump and a part of the lead frame are exposed without being covered. The height of the heat dissipation bump relative to the active surface is unequal to that of the electrical bump relative to the active surface.

摘要翻译： 集成电路封装结构包括芯片，电凸起，散热凸块，引线框架和密封剂。 芯片包括通过使用半导体工艺形成的有源表面和电子元件。 电气凸块通过有源表面电连接到电子部件。 散热凸块连接到有源表面。 引线框架电连接到电气凸块。 密封剂覆盖芯片，引线框架和电气凸块，其中散热凸块和引线框架的一部分在不被覆盖的情况下暴露。 散热凸块相对于活性表面的高度与电凸起相对于活性表面的高度不等同。

公开(公告)号：US08941999B2

公开(公告)日：2015-01-27

申请号：US14046233

申请日：2013-10-04

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01L25/065 ,  H01L23/13 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31

CPC分类号： H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element that has oppositely-facing first and second surfaces and first and second apertures extending between the surfaces. The dielectric element further includes conductive elements. First and second microelectronic elements are stacked one on top of the another. The second microelectronic element has a plurality of contacts at a surface, which is spaced from the first surface of the dielectric element. Leads extend from contacts of the first and second microelectronic elements through respective apertures to at least some of the conductive elements. A heat spreader is thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

摘要翻译： 微电子组件包括具有相对面对的第一和第二表面的介电元件以及在表面之间延伸的第一和第二孔。 电介质元件还包括导电元件。 第一和第二微电子元件堆叠在另一个之上。 第二微电子元件在与电介质元件的第一表面间隔开的表面处具有多个触点。 引线从第一和第二微电子元件的接触通过相应的孔延伸到至少一些导电元件。 散热器热耦合到第一微电子元件或第二微电子元件中的至少一个。

公开(公告)号：US20120061849A1

公开(公告)日：2012-03-15

申请号：US13229924

申请日：2011-09-12

申请人： Romain Coffy ,  Yann Guillou

发明人： Romain Coffy ,  Yann Guillou

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/14519 ,  H01L2224/17519 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A first component includes a slice formed from an integrated circuit chip having a front face and a rear face. An encapsulation block encapsulates the integrated circuit chip such that front and rear faces of the chip and front and rear faces of the encapsulation block are co-planar to form front and rear faces of the slice. Front and rear electrical connection networks are provided on the front and rear faces, respectively, with the electrical connection networks linked by electrical connection vias passing through the encapsulation block. A thermal transfer layer at least partially covers the rear face. A second component may be behind and at a distance from the first component. Connection elements interposed between the first component and the second component include both thermal connection elements in contact with the thermal transfer layer and electrical connection elements interconnecting the first and second components.

摘要翻译： 第一部件包括由具有前表面和后表面的集成电路芯片形成的切片。 封装块封装集成电路芯片，使得芯片的前表面和后表面以及封装块的前后表面是共面的，以形成切片的前后面。 前后电气连接网络分别设置在前表面和后表面上，电连接网络通过通过封装块的电连接通孔连接。 至少部分地覆盖后表面的热转印层。 第二组件可以在第一组件的后面并且距离第一组件一定距离。 插入在第一部件和第二部件之间的连接元件包括与热传递层接触的热连接元件和互连第一和第二部件的电连接元件。