公开(公告)号：US20030194621A1

公开(公告)日：2003-10-16

申请号：US10368960

申请日：2003-02-19

申请人： RIKEN

发明人： Yusuke Tajima ,  Kazuo Takeuchi ,  Yasuo Shigemitsu ,  Etsu Takeuchi

IPC分类号： G03F007/038

CPC分类号： B82Y15/00 ,  B82Y30/00 ,  G03F7/0387 ,  H05K1/023 ,  H05K3/4676 ,  Y10S430/116 ,  Y10S430/121

摘要： A photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating the substrate with the composition and forming fine patterns by exposure of irradiation; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device which comprise coating the substrate with the composition and forming fine patterns by crosslinking the cis-diene group by polycondensation with oxidation with the singlet oxygen generated by exposure of irradiation to the oxygen sensitizer in the presence of oxygen. The photosensitive resin composition of the negative type exhibits high sensitivity and high resolution, can form a resin layer having excellent heat resistance and can be applied to production of semiconductor devices and circuit wiring boards. The printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device can be obtained by using the composition. The processes provide the printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device.

摘要翻译： 一种感光性树脂组合物，其包含氧敏感剂和聚酰胺酸或聚酰亚胺，该侧链具有顺式 - 二烯结构的取代基; 印刷布线板，用于设置半导体芯片的基板和通过用该组合物涂覆基板而制备的半导体器件，并通过照射曝光形成精细图案; 以及用于制造印刷线路板的方法，用于设置半导体芯片的基板和半导体器件，其包括用该组合物涂覆基板并通过与通过曝光产生的单线态氧氧化与顺式二烯基团进行交联而形成精细图案 在氧的存在下照射到氧敏感剂。 负型的感光性树脂组合物显示出高灵敏度和高分辨率，可以形成耐热性优异的树脂层，并且可以应用于半导体器件和电路布线板的制造。 可以通过使用该组合物来获得印刷线路板，用于设置半导体芯片的基板和半导体器件。 这些工艺提供印刷线路板，用于设置半导体芯片的基板和半导体器件。