Abstract:
Record material imageable with a laser beam. The material is a substrate such as paper or polyolefin film having provided on at least one surface thereof a coating containing a solvent-soluble or disperse-type dye suitable for coloring plastics or polymers. Typical solvent-soluble and disperse-type dye include monoazo dyes, diazo dyes, anthraquinone dyes, coumarin dyes, quinoline dyes, xanthene dyes, and naphthalimide dyes. The record material does not show visible dye specks in the coating layer on the substrate because the dye has a very small average particle size—less than 50 microns. No more than 1% of the dye particles are larger than 100 microns. Also, method for imaging a substrate using heat energy by applying heat energy to the described record material to bring about a temperature in the coating greater than the melting temperature of the dye, causing color to become visible in the record material.
Abstract:
Aspects of the invention provide a method of controlling the solid-state property of the solid-phase surface or controlling forming reactive region. The method can be attained by using a device for ejecting droplets and a molecule for inclusion in a SAM which can be photo-patterned in a short period of time using low energy UV radiation, that is TV radiation having a relatively long wavelength. The invention can provide monomolecular film that is formed from molecules comprising a structural component (B) which is hydrophobic and/or lipophobic, and a structural component (A) which decomposes when irradiated with UV light having a wavelength in the range 254-400 nm to cleave away a part of the molecule having the structural component (B) leaving a residual hydrophilic structural component (C). Further, the invention can provide a method of forming a film pattern comprising; at least a step of ejecting a droplet, which includes a compound represented as the following Formula (0), on a solid-phase surface having a functional moiety: X—Y-Z (0) where, X represents a structure having reactivity to a functional moiety which exists at the solid-phase surface, Y represents a decomposable structure by itself and Z represents a structure which is capable of changing solid-state properties on the solid-phase surface or a reactive structure.
Abstract:
A photoreactive composition comprises (a) at least one reactive species that is capable of undergoing an acid- or radical-initiated chemical reaction; and (b) a photoinitiator system comprising photochemically-effective amounts of (1) at least one type of semiconductor nanoparticle quantum dot that has at least one electronic excited state that is accessible by absorption of two or more photons, and (2) a composition, different from said reactive species, that is capable of interacting with the excited state of the semiconductor nanoparticle quantum dot to form at least one reaction-initiating species.
Abstract:
A lithographic printing plate precursor having a photosensitive layer containing (A) at least one saccharide selected from the group consisting of an oligosaccharide and a polysaccharide, (B) a binder polymer, (C) a compound having an addition polymerizable ethylenic unsaturated bond, and (D) a polymerization initiator, or a lithographic printing plate precursor having an undercoat layer comprising (A) at least one saccharide selected from the group consisting of an oligosaccharide and a polysaccharide, and a photosensitive layer containing (B) a binder polymer, (C) a compound having an addition polymerizable ethylenic unsaturated bond, and (D) a polymerization initiator.
Abstract:
A process for fabricating of an article by exposing a photoreactive composition to light under multiphoton absorption conditions. The light passes through an optical system having a final optical element having a numeric aperture in a range of from 0.65 to 1.25, inclusive.
Abstract:
A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.
Abstract:
The present invention relates to a radiation-sensitive mixture which contains an acrylate or methacrylate monomer and/or oligomer capable of free radical polymerization and having at least two acrylate and/or methacrylate groups and at least one photooxidizable group, a photoinitiator, an organic polymeric binder and a heptamethinecyanine dye acting as an IR-absorbing dye. It furthermore relates to a recording material comprising a substrate and a photopolymerizable layer and a process for the production of a printing plate from this recording material. The recording material is distinguished by suitable photosensitivity.
Abstract:
A photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating the substrate with the composition and forming fine patterns by exposure of irradiation; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device which comprise coating the substrate with the composition and forming fine patterns by crosslinking the cis-diene group by polycondensation with oxidation with the singlet oxygen generated by exposure of irradiation to the oxygen sensitizer in the presence of oxygen. The photosensitive resin composition of the negative type exhibits high sensitivity and high resolution, can form a resin layer having excellent heat resistance and can be applied to production of semiconductor devices and circuit wiring boards. The printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device can be obtained by using the composition. The processes provide the printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device.
Abstract:
A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.
Abstract:
The present invention relates to IR-sensitive compositions containing an initator system comprising: (a) at least one compound capable of absorbing IR radiation selected from triarylamine dyes, thiazolium dyes, indolium dyes, oxazolium dyes, cyanine dyes, polyaniline dyes, polypyrrole dyes, polythiophene dyes and phthalocyanine pigments (b) at least one compound capable of producing radicals selected from polyhaloalkyl-substituted compounds (c) at least one polycarboxylic acid represented by the following formula I 1 wherein Y is selected from the group consisting of O, S and NR7, each of R4, R5 and R6 is independently selected from the group consisting of hydrogen, C1-C4 alkyl, aryl which is optionally substituted, nullCOOH and NR8CH2COOH, R7 is selected from the group consisting of hydrogen, C1-C6 alkyl, nullCH2CH2OH, and C1-C5 alkyl substituted with -COOH, R8 is selected from the group consisting of nullCH2COOH, nullCH2OH and null(CH2)2N(CH2COOH)2 and r is 0, 1, 2 or 3 with the proviso that at least one of R4, R5, R6, R7 and R8 comprises a nullCOOH group or salts thereof, and (d) at least one leuco dye, wherein the following inequation is met: oxa