公开(公告)号：US12292605B2

公开(公告)日：2025-05-06

申请号：US17641418

申请日：2020-09-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Seungjae Lee ,  Chia-Te Chou ,  Vivek Raghunathan ,  Brett Sawyer

IPC: G02B6/42 ,  H01L23/00

Abstract: A siliconized heterogeneous optical engine. In some embodiments, the siliconized heterogeneous optical engine includes a photonic integrated circuit; an electro-optical chip, on a top surface of the photonic integrated circuit; an electronic integrated circuit, on the top surface of the photonic integrated circuit; an interposer, on the top surface of the photonic integrated circuit; a redistribution layer, on a top surface of the interposer, the redistribution layer including a plurality of conductive traces; and a plurality of protruding conductors, on the conductive traces of the redistribution layer. The electronic integrated circuit may be electrically connected to the electro-optical chip and to a conductive trace of the plurality of conductive traces of the redistribution layer.

公开(公告)号：US11387186B2

公开(公告)日：2022-07-12

申请号：US16690054

申请日：2019-11-20

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Seungjae Lee ,  Brett Sawyer ,  Chia-Te Chou

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US10962728B2

公开(公告)日：2021-03-30

申请号：US16824609

申请日：2020-03-19

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： David Arlo Nelson ,  Seungjae Lee ,  Brett Sawyer

IPC: G02B6/42 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L31/02

Abstract: An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

公开(公告)号：US11342270B2

公开(公告)日：2022-05-24

申请号：US16690054

申请日：2019-11-20

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Seungjae Lee ,  Brett Sawyer ,  Chia-Te Chou

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US11573387B2

公开(公告)日：2023-02-07

申请号：US16836815

申请日：2020-03-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Brett Sawyer ,  Seungjae Lee ,  Chia-Te Chou ,  Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.