公开(公告)号：US20200294902A1

公开(公告)日：2020-09-17

申请号：US16703096

申请日：2019-12-04

Applicant: ROHM CO., LTD.

Inventor： Hiroshi OJI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device comprising: substrate having main surface facing thickness direction; wirings arranged on main surface; semiconductor element having back surface facing the main surface and electrodes formed on back surface, wherein the electrodes are bonded to the wirings; and columnar wirings located outside the semiconductor element as viewed along the thickness direction, protrude in direction away from the main surface in the thickness direction, and are arranged on the wirings, wherein the semiconductor element includes first circuit and second circuit, wherein the electrodes include first electrodes electrically connected to the first circuit and second electrodes electrically connected to the second circuit, wherein the columnar wirings include first columnar portions electrically connected to the first electrodes and second columnar portions electrically connected to the second electrodes, and wherein area of each first columnar portions is larger than area of each second columnar portions in the thickness direction.

公开(公告)号：US20240112996A1

公开(公告)日：2024-04-04

申请号：US17768374

申请日：2020-10-19

Applicant: ROHM CO., LTD.

Inventor： Hiroshi OJI ,  Hiroyuki SHINKAI ,  Natsuki SAKAMOTO ,  Naoyuki SANO

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L25/165 ,  H01L24/05

Abstract: A semiconductor device includes: a substrate having an obverse and a reverse face; wirings on the obverse face such as a first and a second drive wiring; a semiconductor element connected to the first and second drive wirings; a first drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in a thickness direction and connected to the first drive wiring; a second drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in the thickness direction and connected to the second drive wiring; and a sealing resin covering the wirings and the semiconductor element, while also covering the first and second drive conductor such that their faces opposite to the substrate in the thickness direction are exposed. The first and the second drive conductor are separated in a direction parallel to the obverse face. The first drive conductor is smaller in volume than the second drive conductor.