公开(公告)号：US20240234233A1

公开(公告)日：2024-07-11

申请号：US18616773

申请日：2024-03-26

Applicant: ROHM CO., LTD.

Inventor： Naoyuki SANO ,  Hiroyuki SHINKAI

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3185 ,  H01L21/56 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor device according to the present invention is provided with: a semiconductor element which has an element front surface, an element back surface, and an element lateral surface; a conductive part that is arranged in a position where the conductive part faces the element back surface, and has a wiring part on which the semiconductor element is mounted; and a sealing resin which seals the semiconductor element and the conductive part. The wiring part has a wiring front surface that faces the element back surface, and a wiring back surface. The conductive part has a terminal part which extends from the wiring back surface in a direction that is opposite to the semiconductor element. The sealing resin covers the element back surface, the element lateral surface and the wiring front surface. The element front surface is exposed without being covered by the sealing resin.

公开(公告)号：US20240112996A1

公开(公告)日：2024-04-04

申请号：US17768374

申请日：2020-10-19

Applicant: ROHM CO., LTD.

Inventor： Hiroshi OJI ,  Hiroyuki SHINKAI ,  Natsuki SAKAMOTO ,  Naoyuki SANO

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L25/165 ,  H01L24/05

Abstract: A semiconductor device includes: a substrate having an obverse and a reverse face; wirings on the obverse face such as a first and a second drive wiring; a semiconductor element connected to the first and second drive wirings; a first drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in a thickness direction and connected to the first drive wiring; a second drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in the thickness direction and connected to the second drive wiring; and a sealing resin covering the wirings and the semiconductor element, while also covering the first and second drive conductor such that their faces opposite to the substrate in the thickness direction are exposed. The first and the second drive conductor are separated in a direction parallel to the obverse face. The first drive conductor is smaller in volume than the second drive conductor.

公开(公告)号：US20230083920A1

公开(公告)日：2023-03-16

申请号：US17930087

申请日：2022-09-07

Applicant: ROHM CO., LTD.

Inventor： Yusuke HARADA ,  Hiroyuki SHINKAI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/36

Abstract: A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface, a sealing resin that seals the semiconductor element while covering the substrate main surface, and at least one wiring portion that is connected to the heat-dissipating conductive portion, extends from the heat-dissipating conductive portion to the substrate side surface while being exposed from the substrate back surface, and is exposed from the substrate side surface.

公开(公告)号：US20230091632A1

公开(公告)日：2023-03-23

申请号：US17816826

申请日：2022-08-02

Applicant: ROHM CO., LTD.

Inventor： Satoshi KAGEYAMA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Natsuki SAKAMOTO

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes: a resin layer having a resin main surface; a mounting wiring layer arranged on the resin main surface, and having a mounting wiring main surface facing the same side as the resin main surface and a mounting wiring back surface facing the side of the resin main surface; a semiconductor element including an element wiring layer which is mounted on the mounting wiring main surface, has an element wiring main surface facing the side of the resin layer, and is connected to the mounting wiring layer; and a sealing resin which seals the mounting wiring layer and the semiconductor element, wherein the mounting wiring main surface and the element wiring main surface are rough surfaces having a larger surface roughness than the mounting wiring back surface.

公开(公告)号：US20240234230A1

公开(公告)日：2024-07-11

申请号：US18617040

申请日：2024-03-26

Applicant: Rohm Co., Ltd.

Inventor： Natsuki SAKAMOTO ,  Hiroyuki SHINKAI

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/32238 ,  H01L2224/94 ,  H01L2924/1815

Abstract: An electronic device includes an electronic component, a resin member covering the electronic component, and a conductive member supported by the resin member. The resin member includes a first resin side surface and a second resin side surface that intersect with each other. The conductive member includes a first corner terminal including a first exposed surface exposed from the first resin side surface and a second exposed surface exposed from the second resin side surface. The first corner terminal includes a first surface connected to the first exposed surface and the second exposed surface as viewed in a thickness direction of the resin member. The first surface is covered with the resin member.

公开(公告)号：US20220352105A1

公开(公告)日：2022-11-03

申请号：US17765265

申请日：2020-09-29

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Hideaki YANAGIDA ,  Hirofumi TAKEDA

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L25/16

Abstract: A semiconductor device includes a substrate, a wire portion, a bonding portion, a semiconductor element, and an encapsulation resin. The substrate includes substrate main and back surfaces facing in opposite directions. The wire portion includes a conductive layer formed on the substrate main surface. The bonding portion includes a first plated layer formed on an upper surface of the wire portion and a first solder layer formed on an upper surface of the first plated layer. The semiconductor element includes an element main surface facing the substrate main surface, an element electrode formed on the element main surface, and a second plated layer formed on a lower surface of the element electrode and bonded to the first solder layer. The encapsulation resin covers the semiconductor element. The bonding portion is larger than the element electrode as viewed in a thickness-wise direction that is perpendicular to the substrate main surface.

公开(公告)号：US20210066176A1

公开(公告)日：2021-03-04

申请号：US16939559

申请日：2020-07-27

Applicant: ROHM CO., LTD.

Inventor： Hiroyuki SHINKAI

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/16 ,  H01L23/31

Abstract: There is provided a semiconductor device that includes a wiring layer, a plurality of bonding layers arranged on the wiring layer and having conductivity, and a semiconductor element having a rear surface facing the wiring layer and a plurality of pads provided on the rear surface, and bonded to the wiring layer via the plurality of bonding layers, wherein the plurality of bonding layers are arranged in a grid shape when viewed along a thickness direction, wherein each of the plurality of pads is electrically connected to a circuit formed inside the semiconductor element and any of the plurality of bonding layers, and wherein at least one of the plurality of pads is located to be spaced apart from the plurality of bonding layers when viewed along the thickness direction.