公开(公告)号：US20010010322A1

公开(公告)日：2001-08-02

申请号：US09817587

申请日：2001-03-26

Applicant: ROHM CO., LTD.

Inventor： Kazuya Ikoma

IPC: B23K001/00 ,  B23K031/00

CPC classification number: H01L24/85 ,  B23K31/125 ,  G01N3/00 ,  G01N3/08 ,  G01N19/04 ,  G01N2203/0296 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract translation: 提供一种检查引线条件的方法，其中引线键合条件是由导电线与诸如半导体芯片和引线之类的物体的结合而产生的。 导线由接合工具引导。 根据该检查方法，首先，当线的接合完成时，检测接合工具的第一位置。 然后，施加足够小以防止电线断裂的拉力。 在该状态下，检测接合工具的第二位置。 最后，将焊接工具的第一和第二位置相互比较。