公开(公告)号：US20230402354A1

公开(公告)日：2023-12-14

申请号：US18249005

申请日：2021-10-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Shingo MATSUMARU

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L25/18 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48091 ,  H01L23/49555 ,  H01L2224/4846

Abstract: A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.