公开(公告)号：US20250046687A1

公开(公告)日：2025-02-06

申请号：US18922800

申请日：2024-10-22

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a top surface, a bottom surface, and a first side surface connected to the top surface and the bottom surface. The first side surface includes a first region connected to the top surface, a second region connected to the bottom surface, and a third region connected to the first region and the second region, the plurality of first terminals being exposed to the third region. A surface roughness of each of the top surface, the bottom surface, the first region, and the second region is larger than a surface roughness of the third region.

公开(公告)号：US20240332138A1

公开(公告)日：2024-10-03

申请号：US18742527

申请日：2024-06-13

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2924/1424 ,  H01L2924/182

Abstract: An electronic device includes an electronic component, a sealing resin covering the component, a first terminal protruding from the sealing resin toward a first side in a first direction orthogonal to the thickness direction of the sealing resin, a second terminal protruding from the sealing resin toward the first side in the first direction, and a plurality of third terminals protruding from the sealing resin toward a second side in the first direction. The first terminal and the second terminal are located side by side with a first interval in a second direction orthogonal to the thickness direction and the first direction. The third terminals are arranged in the second direction with a second interval. The first interval is greater than the second interval. The first terminal includes a plurality of first mount portions located at an end opposite to the sealing resin in the first direction.

公开(公告)号：US20240006274A1

公开(公告)日：2024-01-04

申请号：US18465558

申请日：2023-09-12

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI

IPC: H01L23/495 ,  H01L25/18 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49555 ,  H01L23/49575 ,  H01L25/18 ,  H01L23/295 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L23/3121

Abstract: A semiconductor device includes: conductive members including first and second members; a first semiconductor element electrically connected to one conductive member; a second semiconductor element electrically connected to one conductive member configured to receive input of a voltage different from that applied to the first semiconductor element; and a sealing resin covering a part of each conductive member, the first semiconductor element, and the second semiconductor element. The voltage applied to the second member differs from the voltage applied to the first member. The sealing resin contains electrically insulating fillers. When a square cross section having a side length equal to ⅔ of a minimum spacing between two adjacent conductive members is hypothetically defined in the sealing resin, eight or more of the fillers each having a particle size equal to or greater than ⅛ of the minimum spacing are at least partially contained in the square cross section.

公开(公告)号：US20230386983A1

公开(公告)日：2023-11-30

申请号：US18449360

申请日：2023-08-14

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Tomohira KIKUCHI ,  Kenji FUJII ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48175 ,  H01L2224/48137

Abstract: A semiconductor device includes first and second semiconductor elements, a conductive support, a third semiconductor element and a sealing resin. The conductive support includes first and second leads spaced apart in a first direction. The first semiconductor element is supported by the first lead. The second semiconductor element is supported by the second lead. The third semiconductor element, supported by the conductive support, insulates the first semiconductor element and the second semiconductor element. The sealing resin covers a part of the conductive support. A distance d1 between the first lead and the second lead in the first direction is greater than distance d0 given by Equation below. In Equation below, Y is the number of years of insulation life (years) expected for the semiconductor device, A and B are constants determined by a material of the sealing resin, and X is a voltage (kVrms).





d
⁢
0

=



Y
A

B

×
0.15
×
X

公开(公告)号：US20230352379A1

公开(公告)日：2023-11-02

申请号：US18348494

申请日：2023-07-07

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L23/3142 ,  H01L24/48 ,  H01L25/0655 ,  H01L24/85 ,  H01L2924/181 ,  H01L2224/48247 ,  H01L2224/48137

Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a top surface, a bottom surface, and first to third side surfaces. The first terminals include a first edge terminal located closest to the third side surface. The second terminals include a second edge terminal located closest to the third side surface. A first creepage distance, which is a shortest distance from the first edge terminal to the second edge terminal along the first side surface, the third side surface, and the second side surface, is shorter than a second creepage distance, which is a shortest distance from the first edge terminal to the second edge terminal along the first side surface, the bottom surface, and the second side surface.

公开(公告)号：US20230343684A1

公开(公告)日：2023-10-26

申请号：US18343290

申请日：2023-06-28

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/48 ,  H01L23/49562 ,  H01L2224/48245

Abstract: A semiconductor device includes a semiconductor control element, a first drive element, a second drive element, a first insulating element and a second insulating element. In plan view, the first drive element and the second drive element are located on the opposite sides with respect to the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element, relays a signal transmitted from the semiconductor control element to the first drive element, and provides electrical insulation between the semiconductor control element and the first drive element. The second insulating element is located between the semiconductor control element and the second drive element, relays a signal transmitted from the semiconductor control element to the second drive element, and provides electrical insulation between the semiconductor control element and the second drive element.

公开(公告)号：US20230298981A1

公开(公告)日：2023-09-21

申请号：US18324424

申请日：2023-05-26

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/64

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L24/49 ,  H01L23/49503 ,  H01L23/49531 ,  H01L24/85 ,  H01L21/48 ,  H01L24/06 ,  H01L23/645 ,  H01L23/49537 ,  H01L23/4952 ,  H01L23/49517 ,  H01L24/45 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/78301 ,  H01L23/3107

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20220077082A1

公开(公告)日：2022-03-10

申请号：US17465973

申请日：2021-09-03

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/64 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.

公开(公告)号：US20220028763A1

公开(公告)日：2022-01-27

申请号：US17499018

申请日：2021-10-12

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/18

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20200066619A1

公开(公告)日：2020-02-27

申请号：US16671699

申请日：2019-11-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.