公开(公告)号：US06861464B2

公开(公告)日：2005-03-01

申请号：US10199379

申请日：2002-07-19

申请人： Rajan Eadara ,  Mooil Chung ,  David Wen-Lung Chang ,  Sunny K. George ,  Patrick A. Ohaka ,  Joribeth E. Joseff ,  Yushin Ahn

发明人： Rajan Eadara ,  Mooil Chung ,  David Wen-Lung Chang ,  Sunny K. George ,  Patrick A. Ohaka ,  Joribeth E. Joseff ,  Yushin Ahn

IPC分类号： C08L23/06 ,  C08L31/04 ,  C08L77/00 ,  C08L91/00 ,  C09J5/04 ,  C09J5/06 ,  C09J123/08

CPC分类号： C09J5/06 ,  C08L23/06 ,  C08L31/04 ,  C08L77/00 ,  C08L91/00 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2312/00 ,  C08L2666/02 ,  C09J5/04 ,  C09J123/0853 ,  C09J2423/00 ,  C09J2431/00 ,  C09J2477/00

摘要： A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.

摘要翻译： 双组分可固化热熔粘合剂体系包括第一热熔粘合剂制剂，其具有大于室温的软化温度，并且其中包含可固化粘合剂的第一组分。 该系统包括第二热熔粘合剂制剂，其具有大于室温的软化温度，并且其中包含可固化粘合剂的第二组分。 第二组分与第一组分反应以提供固化的粘合剂粘合。 在使用中，将两种制剂加热至高于其软化温度的温度并接触以引起混合。 混合物冷却以提供热塑性粘合物，其随后固化以提供永久性粘合剂粘合。 虽然第一和第二组分分别作为热熔粘合剂进行，但组合第一和第二组分在扩展的温度范围内提供了增强的粘合性能。

公开(公告)号：US06210517B1

公开(公告)日：2001-04-03

申请号：US09290737

申请日：1999-04-13

申请人： Rajan Eadara ,  Mooil Chung ,  David Wen-Lung Chang ,  Weichen Chi

发明人： Rajan Eadara ,  Mooil Chung ,  David Wen-Lung Chang ,  Weichen Chi

IPC分类号： C08J10900

CPC分类号： C09J5/06 ,  C08J5/128 ,  C08L33/08 ,  C09J4/00 ,  C09J2433/00 ,  C08F220/18

摘要： A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50° C. to approximately 200° C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.

摘要翻译： 用于制备非阻塞性可热活化粘合剂的可辐射固化前体涂料组合物包括可固化丙烯酸类材料，可固化弹性体材料和软化温度范围为约50℃至约200℃的烃增粘剂材料 ，其中当丙烯酸材料和弹性体材料固化时，涂料组合物在室温下是非阻挡的，但是当涂料组合物被加热到高于烃增粘剂的软化温度和涂层的Tg时的温度 组合物，涂料组合物变得粘合。