-
公开(公告)号：US20170038159A1
公开(公告)日：2017-02-09
申请号：US14818177
申请日：2015-08-04
申请人： RAYTHEON COMPANY
发明人： Adam C. Wood , Charles J. Bersbach
CPC分类号： F03G7/065 , F28F13/00 , F28F21/02 , F28F2013/006 , F28F2013/008 , F28F2255/04 , F42B15/34 , H01L23/3737 , H01L23/433 , H05K7/1434 , H05K7/20445
摘要： A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
摘要翻译： 提供了热界面。 热界面包括形状记忆材料和导热材料。 热接口被配置为形成为压缩热接口和扩展热接口。 压缩热接口被配置为部分地填充第一部件和第二部件之间的热间隙。 膨胀的热界面构造成基本上填充第一和第二部件之间的热间隙。
-
公开(公告)号：US10267578B2
公开(公告)日：2019-04-23
申请号：US14818177
申请日：2015-08-04
申请人： RAYTHEON COMPANY
发明人： Adam C. Wood , Charles J. Bersbach
IPC分类号： F28F13/00 , F42B15/34 , F03G7/06 , H05K7/20 , H05K7/14 , H01L23/373 , H01L23/433 , F28F21/02
摘要： A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
-
公开(公告)号：US10883777B2
公开(公告)日：2021-01-05
申请号：US16390321
申请日：2019-04-22
申请人： Raytheon Company
发明人： Adam C. Wood , Charles J. Bersbach
IPC分类号： F28F13/00 , F42B15/34 , F03G7/06 , H05K7/20 , H05K7/14 , H01L23/373 , H01L23/433 , F28F21/02
摘要： A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
-
公开(公告)号：US20190249937A1
公开(公告)日：2019-08-15
申请号：US16390321
申请日：2019-04-22
申请人： Raytheon Company
发明人： Adam C. Woods , Charles J. Bersbach
CPC分类号： F28F13/00 , F03G7/065 , F28F21/02 , F28F2013/006 , F28F2013/008 , F28F2255/04 , F42B15/34 , H01L23/3737 , H01L23/433 , H05K7/1434 , H05K7/20445
摘要： A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
-
-
-
搜索结果
4 条记录 (耗时 0.013 秒)
