公开(公告)号：US09942975B2

公开(公告)日：2018-04-10

申请号：US14875222

申请日：2015-10-05

Applicant: Raytheon Company

Inventor： James M. Elliott ,  James S. Wilson ,  David E. Swernofsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

公开(公告)号：US11852270B2

公开(公告)日：2023-12-26

申请号：US17390863

申请日：2021-07-30

Applicant: Raytheon Company

Inventor： David E. Swernofsky ,  Robert Larson

IPC: F16L37/52 ,  F16L17/00

CPC classification number: F16L37/52 ,  F16L17/00

Abstract: A fluid system and a blind-mate fluid fitting can be operable to allow for mating fluid system components even in the presence of angular, radial, and/or axial port misalignment. The blind-mate fluid fitting includes a shoulder and fitting portion extending from one side of the shoulder. The fitting portion defines a central fitting axis and is operable to inserted into a fluid port of a component. The fluid port defines a central port axis. The fitting portion includes a sealing portion that is operable to seal against the fluid port when the central fitting axis is positioned at a zero angle and at least one of a plurality of different non-zero angles relative to the central port axis.

公开(公告)号：US20230036437A1

公开(公告)日：2023-02-02

申请号：US17390863

申请日：2021-07-30

Applicant: Raytheon Company

Inventor： David E. Swernofsky ,  Robert Larson

IPC: F16L37/52 ,  F16L17/00

Abstract: A fluid system and a blind-mate fluid fitting is provided. The blind-mate fluid fitting includes a shoulder and fitting portion extending from one side of the shoulder. The fitting portion defines a central fitting axis and is operable to inserted into a fluid port of a component. The fluid port defines a central port axis. The fitting portion includes a sealing portion that is operable to seal against the fluid port when the central fitting axis is positioned at a zero angle and at least one of a plurality of different non-zero angles relative to the central port axis.

公开(公告)号：US09923293B2

公开(公告)日：2018-03-20

申请号：US15171636

申请日：2016-06-02

Applicant: Raytheon Company

Inventor： David E. Swernofsky ,  Brandon W. Pillans

IPC: H01R24/00 ,  H01R12/75 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01R12/75 ,  H01R9/0515 ,  H01R12/55 ,  H01R12/718 ,  H01R13/2414 ,  H05K1/0243 ,  H05K3/301 ,  H05K2201/10303

Abstract: A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.

公开(公告)号：US20170352969A1

公开(公告)日：2017-12-07

申请号：US15171636

申请日：2016-06-02

Applicant: Raytheon Company

Inventor： David E. Swernofsky ,  Brandon W. Pillans

IPC: H01R12/75 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01R12/75 ,  H01R9/0515 ,  H01R12/55 ,  H01R12/718 ,  H01R13/2414 ,  H05K1/0243 ,  H05K3/301 ,  H05K2201/10303

Abstract: A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.

公开(公告)号：US20170099726A1

公开(公告)日：2017-04-06

申请号：US14875222

申请日：2015-10-05

Applicant: Raytheon Company

Inventor： James M. Elliott ,  James S. Wilson ,  David E. Swernofsky

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/30

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.