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1.发明授权公开(公告)号：US10292255B2
公开(公告)日：2019-05-14
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K1/02 , H01L23/427 , H01L23/433 , H05K1/18 , H05K3/34
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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2.发明授权公开(公告)号：US10887978B2
公开(公告)日：2021-01-05
申请号：US16399754
申请日：2019-04-30
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K7/20 , H05K1/02 , H01L23/427 , H01L23/433 , H05K1/18 , H05K3/34
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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公开(公告)号：US09554488B2
公开(公告)日：2017-01-24
申请号：US14256108
申请日：2014-04-18
Applicant: Raytheon Company
Inventor： Cary C. Kyhl , Scott M. Heston , James M. Elliott
CPC classification number: H05K7/2039 , H01L2224/73253 , H01L2924/16195 , H05K3/303 , H05K3/305 , H05K3/321 , H05K3/3426 , H05K2201/1056 , H05K2201/10628 , H05K2201/10689 , Y02P70/613
Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.
Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。
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公开(公告)号：US09468103B2
公开(公告)日：2016-10-11
申请号：US14509393
申请日：2014-10-08
Applicant: Raytheon Company
Inventor： Robert S. Isom , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度运行的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。
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5.发明授权公开(公告)号：US09942975B2
公开(公告)日：2018-04-10
申请号：US14875222
申请日：2015-10-05
Applicant: Raytheon Company
Inventor： James M. Elliott , James S. Wilson , David E. Swernofsky
CPC classification number: H05K1/0204 , H05K1/0209 , H05K1/142 , H05K3/301 , H05K2201/066 , H05K2201/10242
Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170339779A1
公开(公告)日：2017-11-23
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/0204 , H01L23/4275 , H01L23/4338 , H05K1/181 , H05K3/34 , H05K2201/10227 , H05K2201/10507
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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7.发明申请公开(公告)号：US20190261502A1
公开(公告)日：2019-08-22
申请号：US16399754
申请日：2019-04-30
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K1/02 , H05K1/18 , H05K3/34 , H01L23/433 , H01L23/427
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers.A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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8.发明申请公开(公告)号：US20170099726A1
公开(公告)日：2017-04-06
申请号：US14875222
申请日：2015-10-05
Applicant: Raytheon Company
Inventor： James M. Elliott , James S. Wilson , David E. Swernofsky
CPC classification number: H05K1/0204 , H05K1/0209 , H05K1/142 , H05K3/301 , H05K2201/066 , H05K2201/10242
Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
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公开(公告)号：US20160105963A1
公开(公告)日：2016-04-14
申请号：US14509393
申请日：2014-10-08
Applicant: Raytheon Company
Inventor： Robert S. Isom , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度运行的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。
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公开(公告)号：US20150305191A1
公开(公告)日：2015-10-22
申请号：US14256108
申请日：2014-04-18
Applicant: Raytheon Company
Inventor： Cary C. Kyhl , Scott M. Heston , James M. Elliott
CPC classification number: H05K7/2039 , H01L2224/73253 , H01L2924/16195 , H05K3/303 , H05K3/305 , H05K3/321 , H05K3/3426 , H05K2201/1056 , H05K2201/10628 , H05K2201/10689 , Y02P70/613
Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.
Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。
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