公开(公告)号：US06367040B1

公开(公告)日：2002-04-02

申请号：US09228178

申请日：1999-01-11

申请人： Reinhold Ott ,  Herbert Lammering ,  Dieter Rathei

发明人： Reinhold Ott ,  Herbert Lammering ,  Dieter Rathei

IPC分类号： G01R3128

CPC分类号： H01L22/20

摘要： A method for determining yield impact of process steps for semiconductor wafers having a plurality of dies includes the steps of correlating defects on the dies to electrical failures on the dies to determine hits on the dies, computing kill rates for the dies based on hits for each inspection process, determining a number of dies to be killed by considering kill rates for the dies with hits to weight the defects of each die and determining a yield loss for each inspection process based on the number of dies to be killed and a total number of dies on the semiconductor wafer. A system is also included.

摘要翻译： 用于确定具有多个管芯的半导体晶片的工艺步骤的产量影响的方法包括以下步骤：将管芯上的缺陷与管芯上的电气故障相关联以确定管芯上的击打，基于每个管芯的击打来计算管芯的死亡率 检查过程，通过考虑死亡率的死亡率来确定要死亡的死亡数量，以便对每个死亡的缺陷进行加权，并且基于待杀死的死亡人数和每个检测过程的总数确定每个检查过程的产量损失 在半导体晶片上死亡。 还包括一个系统。

公开(公告)号：US06496958B1

公开(公告)日：2002-12-17

申请号：US09299979

申请日：1999-04-27

申请人： Reinhold Ott ,  Herbert Lammering ,  Heinrich Ollendorf

发明人： Reinhold Ott ,  Herbert Lammering ,  Heinrich Ollendorf

IPC分类号： G06F1750

CPC分类号： G06T7/0004 ,  G01N21/93 ,  G01N21/9501 ,  G06T2207/30148 ,  H01L22/26

摘要： In accordance with the present invention, a method, which may be implemented by employing a program storage device, for determining yield loss for a device includes the steps of determining killing probabilities corresponding to values of inspection parameters based on historic inspection information, determining defects on the device and ordering the defects by classifying the defects according to the inspection parameters. The defects adopt the killing probabilities associated with the same values of the inspection parameters. The method further includes the step of calculating a predicted yield loss based on the defects and the adopted killing probabilities. The method further includes the step of applying statistical process control to the predicted yield loss for all in-line inspection (process) steps.

摘要翻译： 根据本发明，可以通过使用程序存储装置来实现用于确定设备的产量损失的方法包括以下步骤：基于历史检查信息确定与检查参数的值相对应的杀伤概率，确定缺陷 通过根据检查参数对缺陷进行分类，排除缺陷。 缺陷采用与检验参数相同值相关的杀伤概率。 该方法还包括基于缺陷和采用的杀伤概率来计算预测的产量损失的步骤。 该方法还包括将统计过程控制应用于所有在线检验（处理）步骤的预测产量损失的步骤。

公开(公告)号：US06434725B1

公开(公告)日：2002-08-13

申请号：US09603592

申请日：2000-06-26

申请人： Michael Bernhard Sommer ,  Larry Broach ,  Herbert Lammering

发明人： Michael Bernhard Sommer ,  Larry Broach ,  Herbert Lammering

IPC分类号： G06F1750

CPC分类号： H01L22/20

摘要： A method for yield correlation for semiconductor chips, in accordance with the present invention, includes providing test data for a plurality of tests on each of a plurality of semiconductor chips. A global parameter is assigned to each chip as a quality measure based on the test data for that chip. Values for a plurality of parameter classes are determined, and each parameter class represents a parameter measured for each chip tested. A correlation between the values of the parameter classes and the global parameter values for the plurality of chips is then determined. The correlation for each of the parameter classes is compared to identify at least one parameter class, which detracts from chip yield.

摘要翻译： 根据本发明的用于半导体芯片的屈服相关性的方法包括在多个半导体芯片中的每一个上提供用于多个测试的测试数据。 基于该芯片的测试数据，将全局参数分配给每个芯片作为质量测量。 确定多个参数类的值，每个参数类表示为每个测试芯片测量的参数。 然后确定多个芯片的参数类别的值和全局参数值之间的相关性。 比较每个参数类的相关性以识别至少一个参数类，这降低了芯片产量。