摘要:
A means of attachment for electrically contacting electronic components is disclosed. The means of attachment includes a carrier element and a number of elongated connecting elements. Each of the connecting elements is arranged on the carrier element and has an elongated body, which protrudes from the carrier element. Each of the connecting elements and the carrier element includes an electrically conductive surface.
摘要:
The source area (3) is highly doped, like the channel area, for the same conductance type. The drain area (4) is doped for the opposite conductance type. This results in a saving of area since the source connection (S) can at the same time be used as the well connection or substrate connection.
摘要:
A circuit for setting one of a plurality of organization forms of an integrated circuit includes a detector circuit connected to an external connection of the integrated circuit. The external connection in at least one of the organization forms can be used for external communication of the integrated circuit. A signal can be impressed into a signal path connected to the external connection by the detector circuit. As a consequence, an output signal is generated at an output of the detector circuit. A control circuit sets one of the organization forms and receives the output signal of the detector circuit. One of the organization forms is set by the control circuit depending on the state of the output signal of the detector circuit. A module with a detector circuit can identify that organization form of the organization forms in which it is operated in the application.
摘要:
A metallization surface (5), which acts as an etching stop layer during the production of openings (4) in a passivation layer (3) applied to its upper face and protects an interconnect structure (6) arranged underneath it, is arranged in an uppermost metallization level (1). A further opening is produced in the metal surface (5), through which a focused ion beam is aimed at the interconnect structure (6) in order to connect interconnects to one another and/or to interrupt at least one interconnect. The wiring of the integrated circuit can thus be varied individually, starting from identically produced semiconductor chips.
摘要:
An integrated circuit with electrostatic discharge protection includes a first transistor with a source terminal, a drain terminal and a gate terminal, and a second transistor with a source terminal, a drain terminal and a gate terminal. The gate terminal for each of the first and second transistors is connected to the drain terminal. The first transistor is connected in series with the second transistor by one of the drain and source terminals of the first transistor being connected to one of the drain and source terminals of the second transistor. The series circuit formed by the transistors is connected to an input terminal of the integrated circuit or to a supply terminal and a terminal that applies the reference potential of the integrated circuit. The series circuit of the transistors is dimensioned by the number of transistors and the setting of the channel length and channel width ratios of the transistors.
摘要:
An integrated semiconductor memory device includes a first memory zone, a second memory zone, first address connections and a second address connection. A second address signal present at the second address connection specifies the access to the first or second memory zone, whereas it is specified via first address signals at the first address connections which memory cell is accessed within the first or second memory zone. In a first memory configuration, all address connections are driven externally with address signals and the access to a memory cell in the first or second memory zone is controlled. In a second memory configuration, only the first address connections are driven externally whereas a signaling bit in a mode register regulates the access to the first or second memory zone. This provides for access to the second memory zone even if there is no possibility of externally driving the second address connection.
摘要:
An integrated circuit includes a voltage generator with a first controllable resistor and a second controllable resistor, through which a first input terminal that applies a first voltage potential and a second input terminal that applies a second voltage potential can be connected to an output terminal that generates an output voltage. In a manner dependent on the output voltage, a first comparator circuit generates a first control signal to control the first controllable resistor, and a second comparator circuit generates a second control signal to control the second controllable resistor. A control unit evaluates the control signals generated by the comparator circuits and drives the first and second controllable resistors of the voltage generator in such a way that in each case only one of the two controllable resistors has a low-resistance state.
摘要:
An integrated semiconductor memory includes a clock generator circuit driven by an external clock signal and a control circuit driven by the external clock signal. The clock generator circuit generates an internal clock signal with a first level if the external clock signal level lies above a sensitivity level of the clock generator circuit for at least the duration of a sensitivity time of the clock generator circuit, and generates the internal clock signal with a second level if the external clock signal level lies below the sensitivity level for at least the duration of the sensitivity time of the clock generator circuit. The control circuit controls the clock generator circuit such that the control circuit selects the sensitivity time of the clock generator circuit in response to characteristics of the external clock signal.
摘要:
An integrated circuit includes a first circuit component, a second circuit component, and an external terminal for making contact with the circuit. The first circuit component is connected to the external terminal via the second component. A bridging circuit connects the first circuit component to the external terminal and can be activated by a test mode signal. In the active state, the bridging circuit connects the external terminal to the first circuit component while bridging the second circuit component, while it is nonconducting in the deactivated state. Circuit components integrated in the semiconductor chip can be electrically measured nondestructively via activatable switches. Circuit components that lie between the external terminal and the device to be measured can be excluded from the measurement by bridging circuits. The method also makes it possible to measure a plurality of integrated devices in parallel or serially.
摘要:
An integrated semiconductor circuit, having active components lying in mutually adjoining wells of a respective first and second conduction type, wherein the active components respectively are associated with substrate contacts lying in direct proximity to an edge bounding the mutually adjoining wells, is disclosed. Preferably, structures of the active components other than the contacts are arranged to lie further away from the edge and the circuit/layout structures are not mirror-symmetrical with respect to a center line of the circuit chip.