Microcomponent connection system
    2.
    发明申请
    Microcomponent connection system 审中-公开
    微型组件连接系统

    公开(公告)号:US20050158209A1

    公开(公告)日:2005-07-21

    申请号:US10507030

    申请日:2003-02-10

    摘要: A microcomponent connection system (1) having an accomodation device for plate-shaped microcomponents (7) has a connection block (2) and a lifting device (6), by means of which the microcomponent (7) and the connection block (2) can be pressed against one another. The connection block (2) has electrical and fluid line connections (8, 9) and optical line connections (16), each of which projects in a sprung or spring-mounted manner on the underside of the connection block (2). In order to connect the microcomponent (7) to the associated line connections (8, 9, 16), the microcomponent (7) is pressed by the lifting device (6) in the direction of the connection block (2) against the electrical line connections (8) or fluid line connections (9) designed as electrically conducting spring tongues or as hollow rams (10), or optical line connections (16).

    摘要翻译: 具有用于板状微型部件(7)的住宿装置的微型部件连接系统(1)具有连接块(2)和提升装置(6),微型部件(7)和连接块(2)通过该连接块 可以相互压制。 连接块(2)具有电气和流体管线连接(8,9)和光学线路连接(16),每个连接块在弹簧或弹簧安装方式上突出在连接块(2)的下侧。 为了将微型部件(7)连接到相关联的线路连接(8,9,16),微型部件(7)被提升装置(6)沿着连接块(2)的方向抵靠电线 连接(8)或设计为导电弹簧舌片或中空杆(10)或光学线路连接(16)的流体线路连接(9)。