公开(公告)号：US08574933B2

公开(公告)日：2013-11-05

申请号：US13738473

申请日：2013-01-10

申请人： Renesas Electronics Corporation

发明人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。

公开(公告)号：US08492173B2

公开(公告)日：2013-07-23

申请号：US13742788

申请日：2013-01-16

申请人： Renesas Electronics Corporation

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.