公开(公告)号：US20030230332A1

公开(公告)日：2003-12-18

申请号：US10413211

申请日：2003-04-15

Applicant: Research Triangle Institute

Inventor： Rama Venkatasubramanian ,  Edward P. Siivola

IPC: H01L035/30

CPC classification number: B82Y10/00 ,  H01L35/08 ,  H01L35/16 ,  H01L35/30 ,  H01L35/32

Abstract: A thermoelectric device and method of manufacturing the device, where thermoelectric elements of opposite conductivity type are located on respective opposing sides of a heat source member. Heat sinks are disposed on opposite sides of the thermoelectric elements. Peltier metal contacts are positioned between the thermoelectric elements and each of the heat source member and heat sinks. A plurality of devices may be arranged together in a thermally parallel, electrically series arrangement, or in a thermally parallel, electrically parallel arrangement. The arrangement of the elements allow the direction of current flow through the pairs of elements to be substantially the same as the direction of current flow through the metal contacts.

Abstract translation: 一种制造该器件的热电装置及其制造方法，其中相反导电类型的热电元件位于热源部件的相对侧上。 散热器设置在热电元件的相对侧上。 珀耳帖金属触点位于热电元件与热源元件和散热片之间。 多个装置可以以热平行，电串联布置或热平行并联的方式布置在一起。 这些元件的布置允许电流流过成对元件的方向与流过金属触点的电流方向基本相同。

公开(公告)号：US20020174660A1

公开(公告)日：2002-11-28

申请号：US10118236

申请日：2002-04-09

Applicant: Research Triangle Institute

Inventor： Rama Venkatasubramanian

IPC: A61B018/04 ,  H05B001/00 ,  F25B021/02 ,  A61F007/12

CPC classification number: B01L7/54 ,  B01L3/5085 ,  B01L7/52 ,  B01L2400/0448 ,  F25B21/04 ,  H01L23/38 ,  H01L27/14649 ,  H01L35/08 ,  H01L2224/95145 ,  H01L2224/95147 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/1461 ,  H05B3/10 ,  H01L2924/00

Abstract: A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.

Abstract translation: 一种热电冷却和加热装置，包括基板，多个热电元件，其布置在所述基板的一侧上并被配置为执行选择性加热和冷却中的至少一个，使得每个热电元件包括​​热电材料，接触所述热电 材料，并且在电流流动下形成在加热结和冷却结中的至少一个，以及被配置成提供电流通过热电材料和珀尔帖接触的电极。 因此，热电冷却和加热装置选择性地偏置热电元件，以在热电装置的一侧上提供局部加热或冷却接合的格栅。

公开(公告)号：US20030131609A1

公开(公告)日：2003-07-17

申请号：US10340652

申请日：2003-01-13

Applicant: Research Triangle Institute

Inventor： Rama Venkatasubramanian

IPC: F25B021/02 ,  F25B007/00

CPC classification number: F25B21/02 ,  H01L35/16 ,  H01L35/325

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performancenullhigh-ZT BixSb2nullxTe3 and Bi2Te3nullxSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element. By bonding an output heat source plate on the thin-film thermoelectric cooler to an input heat sink plate on the bulk-material thermoelectric cooler, the integration of the thin-film thermoelectric with the bulk-material-based thermoelectric yields a cascade thermoelectric cooler wherein the bulk-material-based thermoelectric cooler cools to 160 K and the thin-film thermoelectric device cools to cryogenic temperatures between 70 and 120 K. Another level of thin-film super-lattice integration can achieve temperatures of 30 K. Alternatively, the integration of a high ZT thin-film superlattice thermoelectric cooler on a multi-staged bulk-material-based thermoelectric cooler can produce a higher performance non-cryogenic cooler.

Abstract translation: 设计用于冷却至30至120K的低温的级联热电冷却器将基于散装材料的热电冷却器的高性能\高ZT BixSb2-xTe3和Bi2Te3-xSe3基超晶格结构薄膜热电装置与基于散装材料的热电冷却器相结合 多个级联冷级，每个连续级联的冷级能够冷却到逐渐降低的温度。 散装材料热电冷却器中的每个冷阶段包括热源板，散热板，p型热电和n型热电。 此外，薄膜热电冷却器可以具有多级，其中每个级包含热源板，散热板，p型超网格热电元件和n型超网格热电元件。 通过将薄膜热电冷却器上的输出热源板结合到散装材料热电冷却器上的输入散热板，薄膜热电与体材料型热电体的集成产生级联热电冷却器，其中 基于散装材料的热电冷却器冷却至160K，薄膜热电装置冷却至70至120K之间的低温温度。另一个级别的薄膜超晶格集成可实现30K的温度。或者，集成 在多级基体材料型热电冷却器上的高ZT薄膜超晶格热电冷却器可以产生更高性能的非低温冷却器。

公开(公告)号：US20030126865A1

公开(公告)日：2003-07-10

申请号：US10237108

申请日：2002-09-09

Applicant: Research Triangle Institute

Inventor： Rama Venkatasubramanian

IPC: F25B021/02 ,  F25B007/00

CPC classification number: F25B21/02 ,  H01L35/16 ,  H01L35/325

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K. integrates high performancenullhigh-ZT BixSb2nullxTe3 and Bi2Te3nullxSe3 based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element. By bonding an output heat source plate on the thin-film thermoelectric cooler to an input heat sink plate on the bulk-material thermoelectric cooler, the integration of the thin-film thermoelectric with the bulk-material-based thermoelectric yields a cascade thermoelectric cooler wherein the bulk-material-based thermoelectric cooler cools to 160 K. and the thin-film thermoelectric device cools to cryogenic temperatures between 70 and 120 K. Another level of thin-film super-lattice integration can achieve temperatures of 30 K. Alternatively, the integration of a high ZT thin-film superlattice thermoelectric cooler on a multi-staged bulk-material-based thermoelectric cooler can produce a higher performance non-cryogenic cooler.

Abstract translation: 设计用于冷却至30至120K的低温的级联热电冷却器。集成了基于散装材料的热电冷却器的高性能\高ZT BixSb2-xTe3和Bi2Te3-xSe3基超晶格结构薄膜热电装置，其包括 多个级联冷级，每个连续级联的冷级能够冷却到逐渐降低的温度。 散装材料热电冷却器中的每个冷阶段包括热源板，散热板，p型热电和n型热电。 此外，薄膜热电冷却器可以具有多级，其中每个级包含热源板，散热板，p型超网格热电元件和n型超网格热电元件。 通过将薄膜热电冷却器上的输出热源板结合到散装材料热电冷却器上的输入散热板，薄膜热电与体材料型热电体的集成产生级联热电冷却器，其中 基于散料的热电冷却器冷却至160K，薄膜热电装置冷却至70至120K之间的低温温度。另一层次的薄膜超晶格集成可实现30K的温度。或者， 在多级基体材料型热电冷却器上集成高ZT薄膜超晶格热电冷却器可以产生更高性能的非低温冷却器。

公开(公告)号：US20010052234A1

公开(公告)日：2001-12-20

申请号：US09812811

申请日：2001-03-21

Applicant: Research Triangle Institute

Inventor： Rama Venkatasubramanian

IPC: F25B021/02

CPC classification number: F25B21/02 ,  H01L35/16 ,  H01L35/325

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performancenullhigh-ZT BixSb2nullxTe3 and Bi2Te3nullxSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element. By bonding an output heat source plate on the thin-film thermoelectric cooler to an input heat sink plate on the bulk-material thermoelectric cooler, the integration of the thin-film thermoelectric with the bulk-material-based thermoelectric yields a cascade thermoelectric cooler wherein the bulk-material-based thermoelectric cooler cools to 160 K and the thin-film thermoelectric device cools to cryogenic temperatures between 70 and 120 K. Another level of thin-film super-lattice integration can achieve temperatures of 30 K. Alternatively, the integration of a high ZT thin-film superlattice thermoelectric cooler on a multi-staged bulk-material-based thermoelectric cooler can produce a higher performance non-cryogenic cooler.

Abstract translation: 设计用于冷却至30至120K的低温的级联热电冷却器将基于散装材料的热电冷却器的高性能\高ZT BixSb2-xTe3和Bi2Te3-xSe3基超晶格结构薄膜热电装置与基于散装材料的热电冷却器相结合 多个级联冷级，每个连续级联的冷级能够冷却到逐渐降低的温度。 散装材料热电冷却器中的每个冷阶段包括热源板，散热板，p型热电和n型热电。 此外，薄膜热电冷却器可以具有多级，其中每个级包含热源板，散热板，p型超网格热电元件和n型超网格热电元件。 通过将薄膜热电冷却器上的输出热源板结合到散装材料热电冷却器上的输入散热板，薄膜热电与体材料型热电体的集成产生级联热电冷却器，其中 基于散装材料的热电冷却器冷却至160K，薄膜热电装置冷却至70至120K之间的低温温度。另一个级别的薄膜超晶格集成可实现30K的温度。或者，集成 在多级基体材料型热电冷却器上的高ZT薄膜超晶格热电冷却器可以产生更高性能的非低温冷却器。