公开(公告)号：US20230331946A1

公开(公告)日：2023-10-19

申请号：US18245347

申请日：2021-09-15

Applicant: Resonac Corporation

Inventor： Shunsuke OTAKE ,  Kazuyuki MITSUKURA ,  Shinji SHIMAOKA ,  Hiroaki FUJITA ,  Masaki TAKAHASHI

IPC: C08J5/24 ,  H01L23/498 ,  H01L21/48 ,  B32B15/14

CPC classification number: C08J5/244 ,  H01L23/49822 ,  H01L23/49894 ,  H01L21/4857 ,  B32B15/14 ,  C08J2379/08 ,  C08J2463/00 ,  B32B2307/7376 ,  B32B2457/00 ,  B32B2260/021 ,  B32B2260/046

Abstract: A method for manufacturing a substrate material for a semiconductor package, including a step of increasing a temperature of a laminated body in which a metal foil, one or more prepregs, and a metal foil are laminated in this order to a hot-press temperature while pressurizing the laminated body. The prepreg contains an inorganic fiber base material and a thermosetting resin composition. A content of the thermosetting resin composition is 40 to 80% by mass on the basis of a mass of the prepreg. In the step of increasing the temperature of the laminated body to the hot-press temperature while pressurizing the laminated body, the laminated body is heated in a condition in which the lowest melt viscosity of the prepreg is 5000 Pa·s or less.

公开(公告)号：US20250112115A1

公开(公告)日：2025-04-03

申请号：US18729041

申请日：2022-12-26

Applicant: Resonac Corporation

Inventor： Masaki TAKAHASHI ,  Hiroaki FUJITA ,  Shinji SHIMAOKA ,  Hirokazu NOMA

IPC: H01L23/373 ,  H01L23/14

Abstract: The present embodiment relates to a semiconductor package including an organic substrate having a circuit, a semiconductor chip that is mounted on a part of one surface of the organic substrate, and is electrically connected to the circuit, and a metal plate that is adhered to the one surface of the organic substrate in at least a part of a region where the semiconductor chip is not mounted, and is not electrically connected to the circuit, a metal constituting the metal plate having an average thermal expansion coefficient at 30 to 260° C. of 3 to 15 ppm/° C.

公开(公告)号：US20240381529A1

公开(公告)日：2024-11-14

申请号：US18691691

申请日：2021-09-15

Applicant: Resonac Corporation

Inventor： Shunsuke OTAKE ,  Kazuyuki MITSUKURA ,  Shinji SHIMAOKA ,  Hiroaki FUJITA ,  Masaki TAKAHASHI

IPC: H05K1/03 ,  H01L23/14 ,  H05K3/46

Abstract: A method for manufacturing a substrate material for a semiconductor package having an insulating substrate includes forming an insulating substrate from a prepreg by a molding treatment including increasing a temperature of a laminated body including two or more laminated sheets of a prepreg while pressurizing the laminated body. The molding treatment includes increasing the temperature of the laminated body under a heating condition in which a melt viscosity of the prepreg increases to 1000×103 Pa·s at a rate of 55×103 Pa·s/min or greater from a time point at which a minimum melt viscosity is exhibited.