公开(公告)号：US20240278536A1

公开(公告)日：2024-08-22

申请号：US18569894

申请日：2021-06-15

Applicant: Resonac Corporation ,  LG Innotek Co.,LTD.

Inventor： Kitaru SATO ,  Takaaki SAKAI ,  Kenji FURUYA ,  Hideyuki MAEDA ,  Hiroshi KODAIRA

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B15/08 ,  H05K1/0373 ,  H05K1/0393 ,  B32B2250/02 ,  B32B2264/1021 ,  B32B2264/301 ,  B32B2264/4021 ,  B32B2379/08 ,  B32B2457/08 ,  H05K2201/0154 ,  H05K2201/05

Abstract: Provided is a bismaleimide composition including: a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3); and silica particles (B) surface-treated with phenylaminosilane, in which the silica particles (B) have an average particle diameter of 100 nm or less, the silica particles (B) have an maximum aggregation particle size of 20 μm or less, and a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.