公开(公告)号：US20220388117A1

公开(公告)日：2022-12-08

申请号：US17337298

申请日：2021-06-02

申请人： Revasum, Inc.

发明人： Robert Lewis Rhoades ,  Bryan Francis Sennett ,  Peter Sterling Patrick Vowell

IPC分类号： B24B55/02 ,  B24B53/017 ,  H01L21/3105 ,  H01L21/321

摘要： The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer being polished by the chemical-mechanical polishing system), a pad conditioner, and a pad cooling mechanism. The pad cooling mechanism of the present disclosure may apply a liquid or gas to the pad (e.g., to an upper surface of the pad) to control the temperature of the pad as the chemical-mechanical polishing process occurs. As a result, the temperature of the pad may be maintained at a safe and operable level for an extended period of time during chemical-mechanical polishing of a wafer.