Adjustable Dual Showerhead
    4.
    发明申请

    公开(公告)号:US20180056308A1

    公开(公告)日:2018-03-01

    申请号:US15684525

    申请日:2017-08-23

    Applicant: Ricardo Borges

    Inventor: Ricardo Borges

    Abstract: An adjustable dual showering unit contains a first showerhead assembly, a second showerhead assembly, and a showerhead arm. The first showerhead assembly and the second showerhead assembly extend from the showerhead arm allowing multiple individuals to shower together. The distance between the first showerhead assembly and the second showerhead assembly is adjustable. The distance from the showerhead arm to a head portion of both the first showerhead assembly and the second showerhead assembly is also adjustable. Moreover, the orientation of the head portion of both the first showerhead assembly and the second showerhead assembly can be adjusted. Moreover, a fluid flow control valve allows the user to control the first showerhead assembly independent of the second showerhead assembly of vice versa. Thus, a unique showering experience is provided.

    Gallium nitride materials including thermally conductive regions
    5.
    发明授权
    Gallium nitride materials including thermally conductive regions 有权
    包括导热区域的氮化镓材料

    公开(公告)号:US06956250B2

    公开(公告)日:2005-10-18

    申请号:US09792409

    申请日:2001-02-23

    CPC classification number: H01L23/3735 H01L29/2003 H01L2924/0002 H01L2924/00

    Abstract: The invention includes providing gallium nitride materials including thermally conductive regions and methods to form such materials. The gallium nitride materials may be used to form semiconductor devices. The thermally conductive regions may include heat spreading layers and heat sinks. Heat spreading layers distribute beat generated during device operation over relatively large areas to prevent excessive localized heating. Heat sinks typically are formed at either the backside or topside of the device and facilitate heat dissipation to the environment. It may be preferable for devices to include a heat spreading layer which is connected to a heat sink at the backside of the device. A variety of semiconductor devices may utilize features of the invention including devices on silicon substrates and devices which generate large amounts of heat such as power transistors.

    Abstract translation: 本发明包括提供包括导热区域的氮化镓材料和形成这种材料的方法。 氮化镓材料可用于形成半导体器件。 导热区域可以包括散热层和散热片。 热扩散层在比较大的区域中分配在设备操作期间产生的节拍,以防止过度的局部加热。 散热器通常形成在设备的背面或顶部的两侧,并且便于对环境的散热。 对于装置来说,优选地包括连接到装置背面的散热器的散热层。 各种半导体器件可以利用本发明的特征,包括硅衬底上的器件和产生大量热量的器件,例如功率晶体管。

    Gallium nitride materials including thermally conductive regions
    6.
    发明申请
    Gallium nitride materials including thermally conductive regions 审中-公开
    包括导热区域的氮化镓材料

    公开(公告)号:US20050127397A1

    公开(公告)日:2005-06-16

    申请号:US11050598

    申请日:2005-02-03

    CPC classification number: H01L23/3735 H01L29/2003 H01L2924/0002 H01L2924/00

    Abstract: The invention includes providing gallium nitride materials including thermally conductive regions and methods to form such materials. The gallium nitride materials may be used to form semiconductor devices. The thermally conductive regions may include heat spreading layers and heat sinks. Heat spreading layers distribute heat generated during device operation over relatively large areas to prevent excessive localized heating. Heat sinks typically are formed at either the backside or topside of the device and facilitate heat dissipation to the environment. It may be preferable for devices to include a heat spreading layer which is connected to a heat sink at the backside of the device. A variety of semiconductor devices may utilize features of the invention including devices on silicon substrates and devices which generate large amounts of heat such as power transistors.

    Abstract translation: 本发明包括提供包括导热区域的氮化镓材料和形成这种材料的方法。 氮化镓材料可用于形成半导体器件。 导热区域可以包括散热层和散热片。 热扩散层在比较大的区域中分配在设备操作期间产生的热量,以防止过度的局部加热。 散热器通常形成在设备的背面或顶部的两侧,并且便于对环境的散热。 对于装置来说,优选地包括连接到装置背面的散热器的散热层。 各种半导体器件可以利用本发明的特征,包括硅衬底上的器件和产生大量热量的器件,例如功率晶体管。

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