摘要:
In one embodiment, an input capacitor balancing circuit for a power supply is provided. The circuit includes an input capacitance operable to filter input power for the power supply. The input capacitance has a first capacitor and a second capacitor coupled in series between an input voltage and a first node. A voltage divider circuit is coupled to the input voltage and operable to generate a divided voltage therefrom. A buffer circuit is operable to receive the divided voltage and, if the first capacitor and the second capacitor are not balanced, to provide current to the input capacitance to balance the first capacitor and the second capacitor.
摘要:
This document discusses, among other things, a circuit including a diode and a transistor. In certain examples, an integrated circuit can include the diode and the transistor. In some examples, an apparatus can include the diode having a first temperature coefficient, a bias resistor configured to bias the diode, and a bipolar junction transistor having a second temperature coefficient the bipolar junction transistor having a base coupled to the diode and the bias resistor, wherein the first temperature coefficient and the second temperature coefficient are configured to reduce at least a portion of a temperature drift effect of the diode and the bipolar transistor.
摘要:
One embodiment of the present disclosure provides a method for controlling a power switch that includes converting a control signal to a current pulse signal, where the control signal is referenced to a first reference potential. The method also includes generating a switch drive voltage signal based on the current pulse signal, where the switch drive signal is referenced to a second reference potential. The method also includes controlling the conduction state of a power switch using the switch drive voltage.
摘要:
In one embodiment, a startup circuit for a power supply is provided. The startup circuit comprises a resistance coupled between a voltage source and a first node. A first capacitor, coupled to the first node, is operable to be charged by current flowing through the resistance. A first transistor has an emitter, a base, and collector, wherein the collector is coupled to the voltage source and the base is coupled to the first node. A diac circuit, coupled to the emitter of the first transistor, is operable to fire to turn on the first transistor, thereby allowing discharge of the first capacitor through the base-emitter junction of the first transistor. A second capacitor is operable to be charged by current related to a discharge voltage resulting from the firing of the diac circuit. The second capacitor operable to store charge to provide VCC voltage to a controller of the power supply.
摘要:
A switch bias system is provided that includes a bipolar junction transistor (BJT) switch comprising a base, emitter, and collector; an energy storage circuit coupled to the collector of the BJT, the energy storage circuit supplying current flow to the collector of the BJT; a current transformer circuit coupled to the emitter, the current transformer circuit configured to sense current flow through the emitter of the BJT switch; and a proportional bias circuit configured to generate a bias current to the base of the BJT switch, the bias current set to a proportion of the sensed current flow through the emitter of the BJT switch.
摘要:
In one embodiment, an input capacitor balancing circuit for a power supply is provided. The circuit includes an input capacitance operable to filter input power for the power supply. The input capacitance has a first capacitor and a second capacitor coupled in series between an input voltage and a first node. A voltage divider circuit is coupled to the input voltage and operable to generate a divided voltage therefrom. A buffer circuit is operable to receive the divided voltage and, if the first capacitor and the second capacitor are not balanced, to provide current to the input capacitance to balance the first capacitor and the second capacitor.
摘要:
Packaged devices and methods for making and using the same are described. The packaged devices contain one or more circuit components, such as a die, that is attached to a leadframe having a first lead, a second lead, and a third lead (although, higher lead counts may be employed in some implementations). A portion of the circuit component and the leadframe are encapsulated in a molded housing so that the first lead is exposed from a first end of the housing while the second and third leads are exposed from a second end of the housing. In some configurations, the packaged device does not contain a fourth lead that is both electrically connected to the first lead and that is exposed from the second end of the molded housing. In other configurations, an area extending from the second lead to the third lead in the molded housing comprises an insulating material having a substantially uniform conductivity. Thus, the packaged devices have relatively large creepage and clearance distances between the first lead and the second and third leads. As a result, the packaged devices are able to operate at relatively high operating voltages without experiencing voltage breakdown. Other embodiments are described.
摘要:
One embodiment of the present disclosure provides a method for controlling a power switch that includes converting a control signal to a current pulse signal, where the control signal is referenced to a first reference potential. The method also includes generating a switch drive voltage signal based on the current pulse signal, where the switch drive signal is referenced to a second reference potential. The method also includes controlling the conduction state of a power switch using the switch drive voltage.
摘要:
A method for allowing measurement corrections on a chip-by-chip basis. Error correction values are generated responsive to the input value to a circuit of the calibrated integrated circuit chip and to a measured value from the circuit of the calibrated integrated circuit chip. The error correction values are stored within an error correction table within a nonvolatile memory of the integrated circuit chip.
摘要:
This document discusses, among other things, apparatus for high-efficiency, thermally-compensated regulators. In an example, a regulator can include a zener diode having a first temperature coefficient, the zener diode configured couple to an output and to provide at least a portion of a reference voltage, a transistor having a second temperature coefficient, the transistor configured to receive the reference voltage, to receive a representation of the output, and to provide feedback information indicative of an error of the output using the representation of the output voltage and the reference voltage, and wherein the first temperature coefficient and the second temperature coefficient are configured to reduce at least a portion of a temperature drift effect of the zener diode and the transistor.