公开(公告)号：US06260957B1

公开(公告)日：2001-07-17

申请号：US09467800

申请日：1999-12-20

申请人： Richard Earl Corley, Jr. ,  Carl Edmond Sullivan ,  Paul Timothy Spivey

发明人： Richard Earl Corley, Jr. ,  Carl Edmond Sullivan ,  Paul Timothy Spivey

IPC分类号： B41J205

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/17563 ,  B41J2002/14403

摘要： A silicon ink filter for a heater chip of an ink jet printhead is formed by micromachining and laser drilling. The heater chip may contain a plurality of such filters for the plurality of nozzles of the printhead. The filter comprises a via constituting an ink entrance area formed by micromachining and a plurality of bores formed at the exit side of the via produced by laser drilling. Protective layers are preferably disposed over the heater chip substrate prior to micromachining and laser drilling.

摘要翻译： 通过微加工和激光钻孔形成用于喷墨打印头的加热器芯片的硅油墨过滤器。 加热器芯片可以包含用于打印头的多个喷嘴的多个这样的过滤器。 过滤器包括构成通过微加工形成的油墨入口区域的通孔和形成在通过激光钻孔产生的通路的出口侧的多个孔。 保护层优选在微加工和激光钻孔之前设置在加热器芯片基板上。

公开(公告)号：US06398354B1

公开(公告)日：2002-06-04

申请号：US09345281

申请日：1999-06-30

申请人： Michael David Lattuca ,  David Amos Ward ,  Richard Earl Corley, Jr. ,  Carl Edmond Sullivan ,  Paul Timothy Spivey

发明人： Michael David Lattuca ,  David Amos Ward ,  Richard Earl Corley, Jr. ,  Carl Edmond Sullivan ,  Paul Timothy Spivey

IPC分类号： B41J2175

CPC分类号： B41J2/17563 ,  B41J2/17503 ,  B41J2/1752 ,  B41J2/17523

摘要： A cartridge body contains one or more printheads on a first surface thereof and one or more connection apertures in flow communication with the one or more printheads, each aperture having an opening on a second surface opposite the first surface, and one or more separate ink filtration devices, each having an ink outlet port connected to the second surface of the cartridge body through an opening so that each ink outlet port is in flow communication with at least one connection aperture. The separate devices enable production of a cartridge body made of a material which is effective for removing heat from the printheads.

摘要翻译： 盒体在其第一表面上包含一个或多个打印头，以及与该一个或多个打印头流动连通的一个或多个连接孔，每个孔在与第一表面相对的第二表面上具有开口，以及一个或多个单独的墨过滤 装置，每个装置具有通过开口连接到盒主体的第二表面的墨水出口，使得每个墨水出口与至少一个连接孔流动连通。 单独的装置能够生产由有效去除打印头热量的材料制成的盒体。

公开(公告)号：US06612032B1

公开(公告)日：2003-09-02

申请号：US09495168

申请日：2000-01-31

申请人： Ashok Murthy ,  Richard Earl Corley, Jr. ,  Kris Ann Reeves ,  Jeanne Marie Saldanha Singh ,  Paul Timothy Spivey

发明人： Ashok Murthy ,  Richard Earl Corley, Jr. ,  Kris Ann Reeves ,  Jeanne Marie Saldanha Singh ,  Paul Timothy Spivey

IPC分类号： B21D5376

CPC分类号： B41J2/1607 ,  B41J2/14024 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2202/20 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/4913 ,  Y10T29/49401

摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

摘要翻译： 本发明涉及一种将半导体芯片附着到喷墨笔体上的方法及其改进的施工技术。 根据该方法，第一粘合剂具有大于约15分钟的固化时间以预定图案分配在喷墨笔体的一个或多个芯片袋中。 包含第二粘合剂的珠粒分配在每个芯片袋的内周边周围的两个或更多个离散位置。 具有芯片边缘的半导体芯片被附接到每个芯片槽中的第二粘合剂，并且第一粘合剂使用热或辐射固化。 使用双粘合剂系统改善了半导体芯片相对于彼此的对准，直到第一粘合剂完全固化。

公开(公告)号：US07018503B2

公开(公告)日：2006-03-28

申请号：US10408543

申请日：2003-04-07

申请人： Ashok Murthy ,  Richard Earl Corley, Jr. ,  Kris Ann Reeves ,  Jeanne Marie Saldanha Singh ,  Paul Timothy Spivey

发明人： Ashok Murthy ,  Richard Earl Corley, Jr. ,  Kris Ann Reeves ,  Jeanne Marie Saldanha Singh ,  Paul Timothy Spivey

IPC分类号： B32B7/14

CPC分类号： B41J2/1607 ,  B41J2/14024 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2202/20 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/4913 ,  Y10T29/49401

摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

公开(公告)号：US08636340B2

公开(公告)日：2014-01-28

申请号：US13046845

申请日：2011-03-14

申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

IPC分类号： B41J2/25

CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。

公开(公告)号：US08313167B2

公开(公告)日：2012-11-20

申请号：US12568739

申请日：2009-09-29

申请人： Frank Edward Anderson ,  Richard Earl Corley, Jr. ,  Michael John Dixon

发明人： Frank Edward Anderson ,  Richard Earl Corley, Jr. ,  Michael John Dixon

IPC分类号： B41J2/155

CPC分类号： B41J2/155 ,  B41J2/14145 ,  B41J2002/14459 ,  B41J2202/20

摘要： An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.

摘要翻译： 一种油墨歧管，其构造有多个半导体瓦片，该半导体瓦片端接到端部固定在刚性基座构件上以形成页宽打印机构。 每个瓦片由一侧的墨水通道构成，与相对侧的墨水出口端口液体连通。 墨水通道将墨水从基底构件中的端口携带到瓦片的出口。 每个瓦片之间的界面定义了边界。 喷墨打印头被紧固在平铺歧管的每个边界上，使得打印头的墨水入口与底层瓦片的墨水出口对准。 没有油墨穿过相邻歧管瓦片的边界。 在制造页宽打印机构时，从半导体晶片制造各个瓦片有利于晶片的使用。