Ink jet printhead with heater chip ink filter
    2.
    发明授权
    Ink jet printhead with heater chip ink filter 有权
    喷墨打印头带加热芯片墨水过滤器

    公开(公告)号:US06260957B1

    公开(公告)日:2001-07-17

    申请号:US09467800

    申请日:1999-12-20

    IPC分类号: B41J205

    摘要: A silicon ink filter for a heater chip of an ink jet printhead is formed by micromachining and laser drilling. The heater chip may contain a plurality of such filters for the plurality of nozzles of the printhead. The filter comprises a via constituting an ink entrance area formed by micromachining and a plurality of bores formed at the exit side of the via produced by laser drilling. Protective layers are preferably disposed over the heater chip substrate prior to micromachining and laser drilling.

    摘要翻译: 通过微加工和激光钻孔形成用于喷墨打印头的加热器芯片的硅油墨过滤器。 加热器芯片可以包含用于打印头的多个喷嘴的多个这样的过滤器。 过滤器包括构成通过微加工形成的油墨入口区域的通孔和形成在通过激光钻孔产生的通路的出口侧的多个孔。 保护层优选在微加工和激光钻孔之前设置在加热器芯片基板上。

    Ink jet cartridge structure
    3.
    发明授权
    Ink jet cartridge structure 失效
    喷墨墨盒结构

    公开(公告)号:US06820959B1

    公开(公告)日:2004-11-23

    申请号:US09089698

    申请日:1998-06-03

    IPC分类号: B41J29377

    摘要: The invention described in the specification relates to an improved ink jet printer cartridge structure which includes a substrate carrier or nose piece upon which semiconductor devices for ink jet printheads are mounted. The substrate carrier has a top surface containing one or more substrate locator wells each well having well walls, a well base and at least one ink feed slot in each well base and side walls attached to the top surface along the perimeter thereof. One or more of the side walls contain fins for heat removal from the substrate carrier and at least two alignment devices attached adjacent at least one of the side walls for precisely aligning the substrate carrier in a printer carriage. Among the advantages of the substrate carrier is that it provides a suitable means for substrate alignment for multiple substrates, a means for cooling multiple substrates, a means for fixedly or removably attaching the carrier to a ink reservoir body and a means for accurately aligning the carrier and reservoir body in a carriage of a printer.

    摘要翻译: 本说明书中描述的本发明涉及一种改进的喷墨打印机盒结构,其包括衬底载体或鼻片,在其上安装用于喷墨打印头的半导体器件。 衬底载体具有包含一个或多个衬底定位器孔的顶表面,每个阱具有井壁,井底和每个井底中的至少一个供墨槽和沿其周边连接到顶表面的侧壁。 侧壁中的一个或多个包含用于从衬底载体散热的翅片和附接到邻近至少一个侧壁的至少两个对准装置,用于将印刷机托架中的基板载体精确对准。 衬底载体的优点之一在于其提供用于多个衬底的衬底对准的合适装置,用于冷却多个衬底的装置,用于将载体固定或可拆卸地附接到储墨体的装置和用于精确对准载体的装置 以及在打印机的托架中的储存器本体。

    Tab circuit design for simplified use with hot bar soldering technique
    5.
    发明授权
    Tab circuit design for simplified use with hot bar soldering technique 有权
    Tab电路设计,简化使用热棒焊接技术

    公开(公告)号:US06357864B1

    公开(公告)日:2002-03-19

    申请号:US09464969

    申请日:1999-12-16

    IPC分类号: B41J205

    摘要: The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.

    摘要翻译: 本发明提供了一种包含在喷墨打印机内的打印头墨盒体,其包含带状自动粘合(TAB)电路,其具有电连接到打印头加热器芯片和印刷电路板(PCB)的独特结构。 此外,TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔,其具有垂直于穿过孔的电迹线对准的长度轴。 每个迹线具有穿过孔的第一端,并且通过热棒焊接技术连接到PCB,并且迹线的第二端连接到打印头加热器芯片。 密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进,并能够重新连接连接而不破坏TAB电路。

    Micro-fluid ejection heads with chips in pockets
    7.
    发明授权
    Micro-fluid ejection heads with chips in pockets 有权
    微型液体喷射头,带有口袋中的芯片

    公开(公告)号:US08061811B2

    公开(公告)日:2011-11-22

    申请号:US11536470

    申请日:2006-09-28

    IPC分类号: B41J2/04

    摘要: Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

    摘要翻译: 提供了微流体喷射头和用于制造微流体喷射头的方法,包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。 一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。 与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。 导电材料沉积在衬底的器件表面附近并与芯片电连通。

    High Resistance Heater Material for A Micro-Fluid Ejection Head
    8.
    发明申请
    High Resistance Heater Material for A Micro-Fluid Ejection Head 审中-公开
    微流体喷头的高阻加热材料

    公开(公告)号:US20080115359A1

    公开(公告)日:2008-05-22

    申请号:US11561993

    申请日:2006-11-21

    IPC分类号: B23P17/00 B41J2/05

    摘要: A thin film heater for a micro-fluid ejection head and methods for making the thin film heater and for making micro-fluid ejection heads containing the thin film heater. In one embodiment, a thin film heater comprises a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys. A sheet resistance of the thin film heater ranges from about 100 to about 600 ohms per square. The thin film heater has a thickness ranging from about 100 to about 800 Angstroms and exhibits improved aluminum/silicon diffusion barrier properties.

    摘要翻译: 用于微流体喷射头的薄膜加热器和用于制造薄膜加热器和用于制造含有薄膜加热器的微流体喷射头的方法。 在一个实施例中,薄膜加热器包括具有主要由AlN,TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料。 薄膜加热器的薄层电阻为约100至约600欧姆/平方。 薄膜加热器具有约100至约800埃的厚度,并且具有改善的铝/硅扩散阻挡性能。