Reticle storage system
    1.
    发明授权
    Reticle storage system 有权
    光栅存储系统

    公开(公告)号:US06690993B2

    公开(公告)日:2004-02-10

    申请号:US09892945

    申请日:2001-06-27

    IPC分类号: G06F700

    摘要: A reticle storage system includes a reticle rack having a series of lateral slots, each for storing a reticle. Access to the reticles is provided on a lateral side of the rack. The enclosure has a series of doors for providing access to the reticles in the slots. An air circulation system flows filtered air past the reticles in the rack to prevent contaminants from accumulating on the reticles. The air circulation system is capable of providing positive air pressure within the enclosure with one door open, thereby preventing contaminants from entering the enclosure through the open door.

    摘要翻译: 光罩存储系统包括具有一系列横向狭槽的光罩架,每个横向狭槽用于存储光罩。 在机架的侧面设有对掩模版的访问。 外壳具有一系列门,用于提供对插槽中的光罩的访问。 空气循环系统将过滤的空气流过机架中的光罩,以防止污染物积聚在标线上。 空气循环系统能够在一个门打开的情况下在外壳内提供正气压,从而防止污染物通过打开的门进入外壳。

    Method and apparatus for placing solder balls on a substrate
    2.
    发明授权
    Method and apparatus for placing solder balls on a substrate 失效
    将焊球放置在基板上的方法和装置

    公开(公告)号:US06641030B1

    公开(公告)日:2003-11-04

    申请号:US09253150

    申请日:1999-02-19

    IPC分类号: B23K3512

    摘要: An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.

    摘要翻译: 一种用于将球体放置在基板上的预定位置的装置。 该装置包括平台,用于在设备中的第一球体放置位置处支撑衬底;以及放置台,设置在平台上方,将球体放置在衬底上的位置。 放置站包括具有容纳球体的腔室的第一容器和具有形成腔室的下表面的基本上水平的上表面的第一托架托盘。 上表面具有第一部分和第二部分,第二部分具有形成在其中的多个孔以接收球体。 第一承载托盘可移动以将第二部分定位在第一容器下方的填充位置和设置在第一球体放置位置之上的位置。 放置台被构造和布置成当第二部分处于填充位置时用球体填充多个孔,并且当第二部分处于位置位置时,将球体放置在基板上的预定位置。

    Solder ball placement method
    4.
    发明授权
    Solder ball placement method 失效
    焊球放置法

    公开(公告)号:US06170737B2

    公开(公告)日:2001-01-09

    申请号:US09090120

    申请日:1998-06-04

    IPC分类号: B23K3512

    摘要: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

    摘要翻译: 用于将焊球阵列放置在衬底上的装置包括具有贯穿其中的孔阵列的载体板。 每个孔都能拿着一个焊球。 具有销排列的球放置头与由载板保持的期望的焊球图形对准。 引脚阵列将焊球的图案通过载体板中的孔推到基板上。

    Solder ball placement apparatus
    5.
    发明授权
    Solder ball placement apparatus 失效
    焊球放置装置

    公开(公告)号:US6056190A

    公开(公告)日:2000-05-02

    申请号:US116012

    申请日:1998-07-15

    摘要: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

    摘要翻译: 用于将焊球阵列放置在衬底上的装置包括具有贯穿其中的孔阵列的载体板。 每个孔都能拿着一个焊球。 具有销排列的球放置头与由载板保持的期望的焊球图形对准。 引脚阵列将焊球的图案通过载体板中的孔推到基板上。 本发明还涉及一种焊球分配器,用于将焊球分配到具有形成在其中的孔阵列的上表面的板。 焊球分配器包括板支撑件,以支撑板,使得上表面与水平方向倾斜一角度,球供给装置向板提供焊球,以及焊球保持器。 焊球保持器可移动穿过板的上表面,用于控制焊球移动穿过板的速度。

    Wafer transfer apparatus
    6.
    发明授权
    Wafer transfer apparatus 失效
    晶圆传送装置

    公开(公告)号:US4986729A

    公开(公告)日:1991-01-22

    申请号:US471708

    申请日:1990-01-29

    摘要: Apparatus for placing a first element at a location on a second element, there being associated with the location some known variation in the shape of the second element, the apparatus including a support member for supporting the first element while the member is translated toward the second element along a placement direction, a transporter for moving the support member or the second element along a transport direction transverse to the placement direction, a sensor for sensing the relative alignment of the support member with the known variation in shape along the transport direction, the sensor including a scanning element that is detachably engageable by the support member, and a holder for storing the scanning element when the scanning element is not in use.

    摘要翻译: 用于将第一元件放置在第二元件上的位置处的装置,其中所述位置与所述位置相关联,所述第二元件的形状已知变化,所述装置包括用于支撑所述第一元件的支撑构件,同时所述构件朝向所述第二元件平移 元件沿着放置方向移动,用于沿横向于放置方向的输送方向移动支撑元件或第二元件的传送器,用于感测支撑元件沿着输送方向的已知变化形式的相对对准的传感器, 传感器,其包括可拆卸地由支撑构件接合的扫描元件;以及保持器,用于当扫描元件不使用时存储扫描元件。