公开(公告)号：US09287467B2

公开(公告)日：2016-03-15

申请号：US14273054

申请日：2014-05-08

申请人： Richard Speer ,  Dave Hamby ,  Adam Scotch

发明人： Richard Speer ,  Dave Hamby ,  Adam Scotch

IPC分类号： H01L23/34 ,  H01L33/48 ,  H01L33/62 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/028 ,  H05K1/0326 ,  H05K1/111 ,  H05K1/118 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0145 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

摘要： Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

摘要翻译： 公开了使用导电环氧接合焊盘将SMD连接到柔性衬底上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨过接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以通过柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

公开(公告)号：US20150325755A1

公开(公告)日：2015-11-12

申请号：US14273054

申请日：2014-05-08

申请人： Richard Speer ,  Dave Hamby ,  Adam Scotch

发明人： Richard Speer ,  Dave Hamby ,  Adam Scotch

IPC分类号： H01L33/48 ,  H05K1/03 ,  H05K1/11 ,  H01L33/62 ,  H05K1/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/028 ,  H05K1/0326 ,  H05K1/111 ,  H05K1/118 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0145 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

摘要： Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

摘要翻译： 公开了使用导电环氧接合焊盘将SMD连接到柔性衬底上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨过接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以通过柔性基板预期承受的弯曲量和/或弯曲的取向来确定。