-
公开(公告)号：US09048157B2
公开(公告)日：2015-06-02
申请号：US13221061
申请日：2011-08-30
IPC分类号： H04N3/14 , H04N5/225 , H01L27/146
CPC分类号： G06T7/0065 , G02B3/0037 , H01L27/14627 , H04N5/23229 , H04N9/045 , H04N2209/042
摘要： A solid-state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and comprising an imaging region including a plurality of pixel blocks each including a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system comprising a microlens array including a plurality of microlenses each corresponding to one of the pixel blocks, and reducing and re-forming the image to be formed on the imaging plane on the pixel blocks corresponding to the respective microlenses. The imaging plane of the first optical system is located further away from the first optical system than the imaging element when the object is located at an infinite distance.
摘要翻译： 根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括：成像区域，包括多个像素块，每个像素块包括多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及第二光学系统，其包括微透镜阵列，所述微透镜阵列包括多个微透镜，每个微透镜各自对应于所述像素块之一，并且在对应于所述各个微透镜的像素块上减小并重新形成将在所述成像平面上形成的图像。 当物体位于无限距离时，第一光学系统的成像平面位于比成像元件更远离第一光学系统的位置。
-
公开(公告)号：US08681249B2
公开(公告)日：2014-03-25
申请号：US13221097
申请日：2011-08-30
CPC分类号： H04N5/232
摘要： A solid-state imaging device according to an embodiment includes: a first optical system configured to form an image of an object on an image formation plane; an imaging element comprising an imaging area which includes a plurality of pixel blocks each including a plurality of pixels; a second optical system configured to include a microlens array including a plurality of microlenses provided to correspond to the plurality of pixel blocks and reduce and re-form an image scheduled to be formed on the image formation plane, in a pixel block corresponding to an individual microlens; and a signal processing unit configured to perform image signal processing with an optical position relation between each microlens and the pixel block corrected, by using an image signal of the object obtained by the imaging element.
摘要翻译： 根据实施例的固态成像装置包括：第一光学系统，被配置为在图像形成平面上形成对象的图像; 成像元件包括：成像区域，其包括多个像素块，每个像素块包括多个像素; 第二光学系统，被配置为包括微透镜阵列，所述微透镜阵列包括多个微透镜，所述微透镜提供为对应于所述多个像素块，并且在对应于个体的像素块中减少并重新形成被调度以形成在所述图像形成平面上的图像 微透镜 以及信号处理单元，被配置为通过使用由所述成像元件获得的所述对象的图像信号，通过校正的每个微透镜与所述像素块之间的光学位置关系来执行图像信号处理。
-
3.发明申请SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL DEVICE AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE 有权固态成像装置，便携式信息终端装置和制造固态成像装置的方法公开(公告)号：US20130075587A1
公开(公告)日：2013-03-28
申请号：US13416036
申请日：2012-03-09
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14618 , H01L24/32 , H01L27/14627 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
摘要翻译： 根据一个实施例，固态成像装置包括具有形成在上表面上的多个像素的传感器基板，形成有多个微透镜的微透镜阵列基板和一端连接到微透镜之间的区域的连接柱 微透镜阵列基板并且另一端结合到上表面。
-
公开(公告)号：US20120062771A1
公开(公告)日：2012-03-15
申请号：US13039504
申请日：2011-03-03
IPC分类号： H04N5/335
CPC分类号： H04N13/218 , H04N13/232
摘要： In one embodiment, a solid-state imaging device includes: an imaging optical system including: a first and second surfaces facing each other; a flat reflector provided on the first surface and having an aperture in an outer circumferential portion; and a plurality of reflectors provided on the second surface and located in a plurality of ring-like areas, each of the reflectors being inclined in a radial direction, the reflectors having different diameters from one another; and an imaging element module including: an imaging element including an imaging area having a plurality of pixel blocks each including a plurality of pixels, and receiving and converting light from the imaging optical system into image data; a visible light transmission substrate provided between the imaging optical system and the imaging element; a microlens array provided on a surface of the visible light transmission substrate on the imaging element side; and an image processing unit processing the image data obtained by the imaging element.
摘要翻译： 在一个实施例中，固态成像装置包括：成像光学系统，包括：彼此面对的第一和第二表面; 设置在第一表面上并在外圆周部分具有孔的平面反射器; 以及设置在所述第二表面上并且位于多个环状区域中的多个反射器，每个所述反射器在径向方向上倾斜，所述反射器彼此具有不同的直径; 以及成像元件模块，包括：成像元件，包括具有多个像素块的成像区域，每个像素块包括多个像素，并且将来自所述成像光学系统的光接收并转换为图像数据; 设置在所述摄像光学系统和所述摄像元件之间的可见光透射基板; 设置在所述可见光透射基板的所述摄像元件侧的表面上的微透镜阵列; 以及图像处理单元，处理由所述成像元件获得的图像数据。
-
5.发明授权Solid imaging device and portable information terminal device having plural pixels being shielded and not shielded from light 有权固体成像装置和便携式信息终端装置，其具有屏蔽并且不被光屏蔽的多个像素公开(公告)号：US08686340B2
公开(公告)日：2014-04-01
申请号：US13361321
申请日：2012-01-30
IPC分类号： H01L27/00
CPC分类号： H01L27/14623 , H01L27/14632 , H01L27/14634
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.
摘要翻译： 根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。 成像基板二维排列有多个像素。 多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。 成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。 遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。
-
公开(公告)号：US20130242161A1
公开(公告)日：2013-09-19
申请号：US13714960
申请日：2012-12-14
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2171
摘要： A solid-state imaging device according to an embodiment includes: an imaging element including a plurality of pixel blocks each containing a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system including a microlens array, the microlens array including a light transmissive substrate, a plurality of first microlenses formed on the light transmissive substrate, and a plurality of second microlenses formed around the first microlenses, a focal length of the first microlenses being substantially equal to a focal length of the second microlenses, an area of the first microlenses in contact with the light transmissive substrate being larger than an area of the second microlenses in contact with the light transmissive substrate, the second optical system being configured to reduce and reconstruct the image formed on the imaging plane on the pixel blocks via the microlens array.
摘要翻译： 根据实施例的固态成像装置包括：成像元件，其包括多个像素块，每个像素块包含多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及包括微透镜阵列的第二光学系统，所述微透镜阵列包括透光衬底，形成在所述透光衬底上的多个第一微透镜以及围绕所述第一微透镜形成的多个第二微透镜，所述第一微透镜的焦距 基本上等于第二微透镜的焦距，与透光基板接触的第一微透镜的面积大于与透光基板接触的第二微透镜的面积，第二光学系统被配置为减小 并且通过微透镜阵列重建在像素块上的成像平面上形成的图像。
-
7.发明授权Solid state imaging device, solid state imaging element, portable information terminal device and method for manufacturing the solid state imaging element 有权固态成像装置，固态成像元件，便携式信息终端装置以及固态成像元件的制造方法公开(公告)号：US08742527B2
公开(公告)日：2014-06-03
申请号：US13416290
申请日：2012-03-09
IPC分类号： H01L21/00 , H01L31/0232
CPC分类号： H01L27/14605 , H01L24/32 , H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.
摘要翻译： 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。
-
公开(公告)号：US08502905B2
公开(公告)日：2013-08-06
申请号：US13039504
申请日：2011-03-03
CPC分类号： H04N13/218 , H04N13/232
摘要： In one embodiment, a solid-state imaging device includes: an imaging optical system including: a first and second surfaces facing each other; a flat reflector provided on the first surface and having an aperture in an outer circumferential portion; and a plurality of reflectors provided on the second surface and located in a plurality of ring-like areas, each of the reflectors being inclined in a radial direction, the reflectors having different diameters from one another; and an imaging element module including: an imaging element including an imaging area having a plurality of pixel blocks each including a plurality of pixels, and receiving and converting light from the imaging optical system into image data; a visible light transmission substrate provided between the imaging optical system and the imaging element; a microlens array provided on a surface of the visible light transmission substrate on the imaging element side; and an image processing unit processing the image data obtained by the imaging element.
摘要翻译： 在一个实施例中，固态成像装置包括：成像光学系统，包括：彼此面对的第一和第二表面; 设置在第一表面上并在外圆周部分具有孔的平面反射器; 以及设置在所述第二表面上并且位于多个环状区域中的多个反射器，每个所述反射器在径向方向上倾斜，所述反射器彼此具有不同的直径; 以及成像元件模块，包括：成像元件，包括具有多个像素块的成像区域，每个像素块包括多个像素，并且将来自所述成像光学系统的光接收并转换为图像数据; 设置在所述摄像光学系统和所述摄像元件之间的可见光透射基板; 设置在所述可见光透射基板的所述摄像元件侧的表面上的微透镜阵列; 以及图像处理单元，处理由所述成像元件获得的图像数据。
-
公开(公告)号：US20120229683A1
公开(公告)日：2012-09-13
申请号：US13221097
申请日：2011-08-30
IPC分类号： H04N9/64
CPC分类号： H04N5/232
摘要： A solid-state imaging device according to an embodiment includes: a first optical system configured to form an image of an object on an image formation plane; an imaging element comprising an imaging area which includes a plurality of pixel blocks each including a plurality of pixels; a second optical system configured to include a microlens array including a plurality of microlenses provided to correspond to the plurality of pixel blocks and reduce and re-form an image scheduled to be formed on the image formation plane, in a pixel block corresponding to an individual microlens; and a signal processing unit configured to perform image signal processing with an optical position relation between each microlens and the pixel block corrected, by using an image signal of the object obtained by the imaging element.
摘要翻译： 根据实施例的固态成像装置包括：第一光学系统，被配置为在图像形成平面上形成对象的图像; 成像元件包括：成像区域，其包括多个像素块，每个像素块包括多个像素; 第二光学系统，被配置为包括微透镜阵列，所述微透镜阵列包括多个微透镜，所述微透镜提供为对应于所述多个像素块，并且在对应于个体的像素块中减少并重新形成被调度以形成在所述图像形成平面上的图像 微透镜 以及信号处理单元，被配置为通过使用由所述成像元件获得的所述对象的图像信号，通过校正的每个微透镜与所述像素块之间的光学位置关系来执行图像信号处理。
-
公开(公告)号：US20120218448A1
公开(公告)日：2012-08-30
申请号：US13221061
申请日：2011-08-30
IPC分类号： H04N5/335
CPC分类号： G06T7/0065 , G02B3/0037 , H01L27/14627 , H04N5/23229 , H04N9/045 , H04N2209/042
摘要： A solid-state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and comprising an imaging region including a plurality of pixel blocks each including a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system comprising a microlens array including a plurality of microlenses each corresponding to one of the pixel blocks, and reducing and re-forming the image to be formed on the imaging plane on the pixel blocks corresponding to the respective microlenses. The imaging plane of the first optical system is located further away from the first optical system than the imaging element when the object is located at an infinite distance.
摘要翻译： 根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括：成像区域，包括多个像素块，每个像素块包括多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及第二光学系统，其包括微透镜阵列，所述微透镜阵列包括多个微透镜，每个微透镜各自对应于所述像素块之一，并且在对应于所述各个微透镜的像素块上减小并重新形成将在所述成像平面上形成的图像。 当物体位于无限距离时，第一光学系统的成像平面位于比成像元件更远离第一光学系统的位置。
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.02 秒)
