公开(公告)号：US06217426B1

公开(公告)日：2001-04-17

申请号：US09287575

申请日：1999-04-06

申请人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

发明人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

IPC分类号： B24B100

CPC分类号： B24B37/26 ,  B24B37/16 ,  Y10S451/921

摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

公开(公告)号：US06575825B2

公开(公告)日：2003-06-10

申请号：US09759858

申请日：2001-01-12

申请人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

发明人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

IPC分类号： B24D1102

CPC分类号： B24B37/26 ,  B24B37/16 ,  Y10S451/921

摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

摘要翻译： 提供了一种用于化学机械抛光系统的抛光垫。 衬垫安装到可旋转的压板上并且包括抛光表面和偏转表面，当与衬底接触时，该抛光表面和偏转表面提供期望的刚度和顺应性。 偏转表面可以包括延伸穿过垫的一个或多个通道，其通向大气。 在一个实施例中，偏转区域限定凸起区域和凹陷区域。 凸起区域为压板提供安装表面，而凹陷区域允许焊盘的顺应性。 在另一个实施例中，偏转区域包括限定多个倾斜突起的多个通道。 通道可以不相交，使得倾斜突起是设置在垫上的细长部分。 或者，通道可以相交，使得倾斜的突起彼此隔离并且以间隔的关系设置在垫上。

公开(公告)号：US6132298A

公开(公告)日：2000-10-17

申请号：US200492

申请日：1998-11-25

申请人： Steven Zuniga ,  Hung Chen ,  Gopalakrishna B. Prabhu

发明人： Steven Zuniga ,  Hung Chen ,  Gopalakrishna B. Prabhu

IPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/304 ,  B24B7/22

CPC分类号： B24B37/32 ,  B24B37/30

摘要： A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.

摘要翻译： 特别适用于平坦化基材的化学机械抛光的载体头包括柔性膜和边缘负载环。 柔性膜的下表面提供了用于衬底的中心部分的接收表面，而边缘负载环的下表面为衬底的周边部分提供了接收表面。 适用于化学机械抛光平底基材的浆料包括水，倾向于附聚的胶体二氧化硅，以及趋于不凝聚的热解法二氧化硅。

公开(公告)号：US06361420B1

公开(公告)日：2002-03-26

申请号：US09500137

申请日：2000-02-08

申请人： Steven Zuniga ,  Hung Chen ,  Gopalakrishna B. Prabhu

发明人： Steven Zuniga ,  Hung Chen ,  Gopalakrishna B. Prabhu

IPC分类号： B24B722

CPC分类号： B24B37/32 ,  B24B37/30

摘要： A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.

摘要翻译： 特别适用于平坦化基材的化学机械抛光的载体头包括柔性膜和边缘负载环。 柔性膜的下表面提供了用于衬底的中心部分的接收表面，而边缘负载环的下表面为衬底的周边部分提供了接收表面。 适用于化学机械抛光平底基材的浆料包括水，倾向于附聚的胶体二氧化硅，以及趋于不凝聚的热解法二氧化硅。

公开(公告)号：US06572446B1

公开(公告)日：2003-06-03

申请号：US09664603

申请日：2000-09-18

申请人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

发明人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

IPC分类号： B24B5100

CPC分类号： B24B37/20 ,  B24B37/26 ,  B24B53/017

摘要： A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.

摘要翻译： 垫调节组件包括具有可与抛光垫接触的末端执行器的调节头，设置在末端执行器底部的多个向下突出的可移动调节元件; 以及设置在调节元件上方并与其相邻的柔顺背衬构件，其中由柔性背衬构件施加的力被传递到可移动调节元件以移动调节元件。 在一个方面，加压电路将来自压力源的压力施加到柔性背衬构件上，以使柔顺背衬构件抵靠可动调节元件弯曲。

公开(公告)号：US20050186892A1

公开(公告)日：2005-08-25

申请号：US11029287

申请日：2005-01-05

申请人： Hung Chen ,  Steven Zuniga ,  Charles Garretson ,  Thomas Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

发明人： Hung Chen ,  Steven Zuniga ,  Charles Garretson ,  Thomas Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

IPC分类号： B24B37/16 ,  B24B41/047 ,  B24B1/00

CPC分类号： B24B37/16

摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

摘要翻译： 用于基板的化学机械抛光的压板包括可以放置抛光垫的表面，支撑结构和控制器。 表面具有第一区域和第二区域，并且可操作以在抛光期间对抛光垫施加力。 支撑结构位于第二区域下方并且可操作以使第二区域施加比第一区域更多的力。 控制器可操作以调节由第二区域施加的力的量。

公开(公告)号：US20050126708A1

公开(公告)日：2005-06-16

申请号：US10732966

申请日：2003-12-10

申请人： Hung Chen ,  Steven Zuniga

发明人： Hung Chen ,  Steven Zuniga

IPC分类号： B24B37/04 ,  B24B41/06 ,  H01L21/306

CPC分类号： B24B37/32

摘要： A retaining ring for chemical mechanical polishing has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The bottom surface includes a plurality of channels, each channel extending from the inner diameter surface to the outer diameter surface and having a rounded ceiling.

摘要翻译： 用于化学机械抛光的保持环具有大致环形体，其具有顶表面，底表面，内径表面和外径表面。 底表面包括多个通道，每个通道从内径表面延伸到外径表面并且具有圆形天花板。

公开(公告)号：US6159079A

公开(公告)日：2000-12-12

申请号：US149806

申请日：1998-09-08

申请人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

发明人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

IPC分类号： B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

公开(公告)号：US20070082589A1

公开(公告)日：2007-04-12

申请号：US11245867

申请日：2005-10-06

申请人： Steven Zuniga ,  Hung Chen ,  Thomas Brezoczky ,  Steven Mear

发明人： Steven Zuniga ,  Hung Chen ,  Thomas Brezoczky ,  Steven Mear

IPC分类号： B24B29/00

CPC分类号： B24B37/30 ,  B24B49/16

摘要： A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.

摘要翻译： 描述了一种用于化学机械抛光的系统，该系统具有可被构造成压力区的具有可加压室的载体头。 该系统包括具有用于在抛光期间接触基底的膜的载体头部。 膜后面的可加压室与压力输入连通。 压力输入可以为可加压室提供不同的压力。 一些可加压室可以与多于一个的压力输入连通。 可以布置压力区域，其中每个区域包括一个或多个可加压室。 这些区域可以通过改变构成每个区域的可加压室来配置。

公开(公告)号：US20060154580A1

公开(公告)日：2006-07-13

申请号：US11321006

申请日：2005-12-28

申请人： Hung Chen ,  Jeonghoon Oh ,  Steven Zuniga

发明人： Hung Chen ,  Jeonghoon Oh ,  Steven Zuniga

IPC分类号： B24B29/00

CPC分类号： B24B37/30

摘要： A flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus has a central portion with an outer surface providing a substrate receiving surface, a perimeter portion for connecting the central portion to a base of the carrier head, and at least one flap extending from an inner surface of the central portion. The flap includes a laterally extending first section and a vertically extending second section connecting the laterally extending first section to the central portion.

摘要翻译： 用于与基底化学机械抛光装置的载体头一起使用的柔性膜具有中心部分，其外表面提供基底接收表面，周边部分用于将中心部分连接到载体头部的基部，以及至少一个 翼片从中心部分的内表面延伸。 翼片包括横向延伸的第一部分和将横向延伸的第一部分连接到中心部分的垂直延伸的第二部分。