公开(公告)号：US06274252B1

公开(公告)日：2001-08-14

申请号：US08950529

申请日：1997-10-14

申请人： Robert E. Naugler ,  Frank E. Anderson

发明人： Robert E. Naugler ,  Frank E. Anderson

IPC分类号： B32B1504

CPC分类号： C03C27/02 ,  Y10T403/217 ,  Y10T428/12535

摘要： A hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e.g., gold) coating is applied to the conductive pin before the hermetic seal is formed. The noble metal-coated conductive pin is located in glass having a softening point less than about 650° C. and disposed in a cavity of the outer body. This is accomplished by inserting the coated conductive pin into a bore in a glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700° C., and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.

摘要翻译： 在导电销和外部主体之间的密封玻璃对金属密封，其中在形成气密密封之前，将耐腐蚀的贵金属（例如金）涂层施加到导电销上。 贵金属涂覆的导电针位于软化点小于约650℃的玻璃中，并设置在外体的空腔中。 这通过将涂覆的导电销插入玻璃预制件中的孔中，将组件加热到超过玻璃的软化点但小于约700℃的温度，并冷却组件来实现。 优选地选择组件的部件的热膨胀系数，使得所得的组件是密封的压缩密封。

公开(公告)号：US5709724A

公开(公告)日：1998-01-20

申请号：US286015

申请日：1994-08-04

申请人： Robert E. Naugler ,  Frank E. Anderson

发明人： Robert E. Naugler ,  Frank E. Anderson

IPC分类号： C03C27/02

CPC分类号： C03C27/02

摘要： A process for forming a hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e.g., gold) coating is applied to the conductive pin before the hermetic seal is formed. The process generally includes providing a noble metal-coated conductive pin, placing glass having a softening point less than about 650.degree. C. into a cavity of the outer body, inserting the coated conductive pin into a bore in the glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700.degree. C., and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.

摘要翻译： 一种用于在导电销和外部主体之间形成密封玻璃 - 金属密封件的方法，其中在形成气密密封件之前，将耐腐蚀的贵金属（例如金）涂层施加到导电销上。 该方法通常包括提供贵金属涂覆的导电针，将具有小于约650℃的软化点的玻璃放置到外体的空腔中，将涂覆的导电针插入玻璃预制件的孔中，加热组件 达到超过玻璃软化点但小于约700℃的温度，并冷却组件。 优选地选择组件的部件的热膨胀系数，使得所得的组件是密封的压缩密封。

公开(公告)号：US08366952B2

公开(公告)日：2013-02-05

申请号：US12758161

申请日：2010-04-12

申请人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

发明人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

IPC分类号： G01D15/00 ,  G11B5/127

CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/164 ,  Y10T29/49401

摘要： A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

摘要翻译： 一种具有改进的低能量设计的微流体喷射装置结构及其方法。 这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。 在选自TaAl，Ta2N，TaAl（O，N），TaAlSi，Ti（N，O），WSi（O，N），TaAlN等的电阻层的绝缘层上形成多个加热电阻体， 和TaAl / TaAlN。 选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。 电极从第一金属导电层形成在牺牲层上，以提供与多个加热电阻器的阳极和阴极连接。 牺牲层在等离子体氧化过程中被氧化以在多个加热电阻器上提供流体接触层。

公开(公告)号：US20110009255A1

公开(公告)日：2011-01-13

申请号：US11538409

申请日：2006-10-03

申请人： Frank E. Anderson ,  Kevin R. McNerney ,  Steven M. Brazil

发明人： Frank E. Anderson ,  Kevin R. McNerney ,  Steven M. Brazil

IPC分类号： C04B35/565 ,  C04B35/563

CPC分类号： C04B40/0089 ,  C04B35/563 ,  C04B35/6316 ,  C04B35/65 ,  C04B2235/3821 ,  C04B2235/3826 ,  C04B2235/383 ,  C04B2235/3834 ,  C04B2235/422 ,  C04B2235/424 ,  C04B2235/425 ,  C04B2235/428 ,  C04B2235/48 ,  C04B2235/5436 ,  C04B2235/77 ,  C04B2235/79 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607

摘要： A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more. The method also includes siliconizing a first portion of the boron carbide to siliconized boron carbide by contacting the green body with a molten silicon infiltrant, where the infiltrant has a temperature of about 1625° C. to about 1700° C. The method may further include dissolving a second portion of the boron carbide in the silicon infiltrant, where at least some of the dissolved boron carbide is reprecipated as smooth particulates.

摘要翻译： 一种反应结合的陶瓷体，其具有50重量％至60重量％的碳化硼和20重量％至30重量％的碳化硅。 反应结合的陶瓷体具有与硅反应的碳化硼的至少一部分成为硅化碳化硼。 另外，制造反应结合陶瓷材料的方法。 该方法可以包括以下步骤：从碳化硼，碳和有机粘合剂的混合物形成生坯，并使生坯与包含硅的液体渗透剂接触。 浸渍剂具有约1625℃至约1700℃的温度。此外，制备反应结合碳化硼陶瓷体的方法。 该方法包括从碳化硼，碳和有机粘合剂的混合物形成生坯体的步骤。 生坯中碳化硼与碳的重量比可以为约5:5至1或更大。 该方法还包括通过使生坯与熔融硅浸润剂接触将碳化硼的第一部分硅化成硅化碳化硼，其中浸渗剂具有约1625℃至约1700℃的温度。该方法还可包括 将第二部分碳化硼溶解在硅浸润剂中，其中至少一些溶解的碳化硼被再沉淀为平滑颗粒。

公开(公告)号：US4414036A

公开(公告)日：1983-11-08

申请号：US303354

申请日：1981-09-18

申请人： Frank E. Anderson ,  Robert A. Martin

发明人： Frank E. Anderson ,  Robert A. Martin

IPC分类号： B67C3/00 ,  B08B9/00

CPC分类号： B67C3/001

摘要： A sanitizing method and a sanitizer system to be attached to a conventional circular bottle filling machine as used for filling beverage bottles, the system including a plurality of collector manifolds, each manifold being adapted to collect sanitizing liquid from a plurality of adjacent filler valves, there being a sufficient number of manifolds with plural valve engaging tubes to accommodate every filler valve of a particular machine; the manifolds are connectable by flexible hoses to a rotating collector which is preferably permanently installed at the top of the bottle filler machine so that the entry ports of the collector rotate with the rotating conveyor table of the machine and the exit port of the collector is from a stationary portion thereof. There is a provision for passage of carbon dioxide gas through the center of the collector in cases where the bottle filler machine employs an overhead supply conduit for carbon dioxide to maintain carbonation in the beverage in the filler bowl. Jacks are provided for the manifolds to hold them firmly up against the seals of the filler valves. Hoses are connectable to the manifolds by quick connect fittings and the rotating table is provided with retainers to hold the ends of the hoses while the sanitizer system is not in use and the machine is being used in a normal filling operation. The manifolds are completely removable and there is no modification required to the filler valves or other parts of the machine which might interfere with the normal filling operation.

摘要翻译： 一种消毒方法和消毒系统，其连接到用于填充饮料瓶的常规圆瓶灌装机，该系统包括多个收集器歧管，每个歧管适于从多个相邻的填充阀收集消毒液体，那里 是具有多个阀接合管的足够数量的歧管，以容纳特定机器的每个填充阀; 歧管可以通过柔性软管连接到旋转收集器，旋转收集器优选地永久地安装在加瓶机的顶部，使得收集器的入口端口与机器的旋转输送机台旋转，并且收集器的出口端口从 其固定部分。 在填充机器采用用于二氧化碳的塔顶供给导管以保持填料碗中的饮料中的碳酸化的情况下，存在通过集电器中心的二氧化碳气体通过的规定。 为歧管提供插孔以将其紧紧地固定在填充阀的密封件上。 软管可以通过快速连接配件连接到歧管，旋转台上设有保持器，用于在消毒器系统不使用的同时将机器保持在软管的两端，并且机器正在正常的灌装操作中使用。 歧管是完全可拆卸的，并且对于可能干扰正常填充操作的加注阀或机器的其它部件，不需要修改。

公开(公告)号：US07414262B2

公开(公告)日：2008-08-19

申请号：US11241221

申请日：2005-09-30

申请人： Frank E. Anderson ,  Robert W. Cornell ,  Yimin Guan

发明人： Frank E. Anderson ,  Robert W. Cornell ,  Yimin Guan

IPC分类号： H01L29/06

CPC分类号： H01L29/78603 ,  H01L27/1292 ,  H01L29/66757 ,  H01L29/74

摘要： Electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the printed material and substrate are part of an electronic device having at least three terminals, wherein the electronic device has a charge carrier mobility of at least 10 cm2/V-s. Multi-terminal devices can have a substrate including a doped semiconductor layer and at least two doped regions formed upon the substrate. The doped regions can be doped oppositely from the semiconductor layer and exhibit a charge carrier mobility of greater than 10 cm2/V-s. Methods for making the same are also disclosed.

摘要翻译： 诸如在柔性基底上具有柔性基底和印刷材料的电子器件。 在一个实施例中，印刷材料和基底是具有至少三个端子的电子器件的一部分，其中电子器件具有至少10cm 2 / V-s的电荷载流子迁移率。 多端子器件可以具有包括掺杂半导体层和形成在衬底上的至少两个掺杂区的衬底。 掺杂区域可以与半导体层相反地掺杂并且表现出大于10cm 2 / V-s的电荷载流子迁移率。 还公开了制备其的方法。

公开(公告)号：US07396186B2

公开(公告)日：2008-07-08

申请号：US11673010

申请日：2007-02-09

申请人： Philip J. Quenzi ,  Carl B. Kieranen ,  Frank E. Anderson ,  Jeffrey W. Torvinen ,  Mark A. Pietila

发明人： Philip J. Quenzi ,  Carl B. Kieranen ,  Frank E. Anderson ,  Jeffrey W. Torvinen ,  Mark A. Pietila

IPC分类号： E01C23/01

CPC分类号： E01C19/40 ,  E01C19/006 ,  E01C19/405 ,  E01C2301/20 ,  E04F21/247 ,  E04G21/066

摘要： A screeding device for screeding a concrete surface includes a support member, a screed head assembly mounted to the support member, and a control. The screed head assembly includes a grade setting device and a vibrating member, and is selectively movable in a screeding direction over and along the concrete surface by the support member. The vibrating member is vibratable to screed the concrete surface as the screed head assembly is moved in the screeding direction over and along the concrete surface. The control is operable to automatically stop vibration of the vibrating member when the support member is not moving the screed head assembly in the screeding direction and to automatically vibrate the vibrating member when the support member moves the screed head assembly in the screeding direction.

摘要翻译： 用于熨平混凝土表面的刮平装置包括支撑构件，安装到支撑构件的熨平板头组件和控制装置。 熨平头组件包括坡度调节装置和振动构件，并且可以通过支撑构件在混凝土表面上并沿着刮板方向选择性地移动。 当熨平板头组件沿着整平方向在混凝土表面上和沿着混凝土表面移动时，振动构件可振动以对混凝土表面进行熨平。 当支撑构件在熨平板方向上不使熨平板头组件移动时，控制可自动停止振动构件的振动，并且当支撑构件沿熨平方向移动熨平板头组件时，自动振动振动构件。

公开(公告)号：US07195343B2

公开(公告)日：2007-03-27

申请号：US10927796

申请日：2004-08-27

申请人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

发明人： Frank E. Anderson ,  Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/164 ,  Y10T29/49401

摘要： A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

摘要翻译： 一种具有改进的低能量设计的微流体喷射装置结构及其方法。 这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。 在选自TaAl，Ta2N，TaAl（O，N），TaAlSi，Ti（N，O），WSi（O，N），TaAlN等的电阻层的绝缘层上形成多个加热电阻体， 和TaAl / TaAlN。 选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。 电极从第一金属导电层形成在牺牲层上，以提供与多个加热电阻器的阳极和阴极连接。 牺牲层在等离子体氧化过程中被氧化，以在多个加热电阻器上提供流体接触层。

公开(公告)号：US07055756B2

公开(公告)日：2006-06-06

申请号：US10973106

申请日：2004-10-25

申请人： Frank E. Anderson ,  Yimin Guan

发明人： Frank E. Anderson ,  Yimin Guan

IPC分类号： G06K19/06 ,  H05K1/03 ,  H05K1/05

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2203/013 ,  Y10T428/24802 ,  Y10T436/209163

摘要： A method of fabricating an RFID antenna, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a conductive antenna. The invention also includes an RFID tag comprising: (a) a substrate including a plurality of micropores; (b) a microchip; and (c) an RFID antenna in electrical communication with the microchip and contacting the substrate, the RFID antenna comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.

摘要翻译： 一种制造RFID天线的方法，所述方法包括：（a）以预定图案将浆料沉积在基底上，所述基底包括多个微孔，用于从所述基底的表面排出所述浆液的流体成分，同时 将所述浆料的导电颗粒保持在所述基底的表面上; 和（b）干燥导电颗粒以将导电颗粒固定在基板的表面上并提供导电天线。 本发明还包括RFID标签，其包括：（a）包括多个微孔的基底; （b）微芯片; 和（c）与微芯片电连通并接触基板的RFID天线，RFID天线包括通过从喷墨打印机喷射浆料而沉积在基板上的导电颗粒。

公开(公告)号：US20120236076A1

公开(公告)日：2012-09-20

申请号：US13046845

申请日：2011-03-14

申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

IPC分类号： B41J2/145 ,  B23P17/00

CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。