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    Substrate gripper for a substrate handling robot
    4.
    发明授权
    Substrate gripper for a substrate handling robot 有权
    用于基板处理机器人的基板夹具

    公开(公告)号：US07374391B2

    公开(公告)日：2008-05-20

    申请号：US11315873

    申请日：2005-12-22

    申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： B25J15/00

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    Substrate gripper for a substrate handling robot
    5.
    发明申请
    Substrate gripper for a substrate handling robot 有权
    用于基板处理机器人的基板夹具

    公开(公告)号：US20070147979A1

    公开(公告)日：2007-06-28

    申请号：US11315873

    申请日：2005-12-22

    申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： B66C23/00

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    SYSTEMS AND METHODS FOR TRANSFERRING SMALL LOT SIZE SUBSTRATE CARRIERS BETWEEN PROCESSING TOOLS
    6.
    发明申请
    SYSTEMS AND METHODS FOR TRANSFERRING SMALL LOT SIZE SUBSTRATE CARRIERS BETWEEN PROCESSING TOOLS 有权
    用于传送加工工具之间的小尺寸基板载体的系统和方法

    公开(公告)号：US20070059861A1

    公开(公告)日：2007-03-15

    申请号：US11555252

    申请日：2006-10-31

    申请人： Michael Rice ,  Eric Englhardt ,  Vinay Shah ,  Martin Elliott ,  Robert Lowrance ,  Jeffrey Hudgens

    发明人： Michael Rice ,  Eric Englhardt ,  Vinay Shah ,  Martin Elliott ,  Robert Lowrance ,  Jeffrey Hudgens

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67727 ,  H01L21/67276 ,  H01L21/67769 ,  H01L21/67778 ,  Y02P80/40 ,  Y02P90/86

    摘要： In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

    摘要翻译： 在第一方面，提供了一种在小批量半导体器件制造设施内管理正在进行的工作的方法。 第一种方法包括提供具有（1）多个处理工具的小批量半导体器件制造设备; 和（2）适于在处理工具之间运输小批量衬底载体的高速运输系统。 该方法还包括：（1）增加小批量半导体器件制造设备内的低优先级衬底的平均周期时间，使小批量半导体器件制造设备内的预定工作保持在进行中; 和（2）减小小批量半导体器件制造设备内的高优先级衬底的平均周期时间，以便在小批量半导体器件制造设备内大致维持预定工作进行中的水平。 提供了许多其他方面。

    SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL
    8.
    发明申请
    SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL 有权
    卡特彼勒机器人工具中的基板处理序列

    公开(公告)号：US20070147976A1

    公开(公告)日：2007-06-28

    申请号：US11553820

    申请日：2006-10-27

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    Method of retaining a substrate during a substrate transferring process
    9.
    发明申请
    Method of retaining a substrate during a substrate transferring process 有权
    在衬底转移过程中保持衬底的方法

    公开(公告)号：US20070147982A1

    公开(公告)日：2007-06-28

    申请号：US11398218

    申请日：2006-04-05

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。