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公开(公告)号：US5911596A
公开(公告)日：1999-06-15
申请号：US794809
申请日：1997-02-04
申请人： Robert S. Antonuccio , David E. Desilets , Joseph M. Spano , Mathew J. Palazola , William A. Izzicupo , James M. Carney , Daniel D. Gonsalves , Mark R. Pugliese
发明人： Robert S. Antonuccio , David E. Desilets , Joseph M. Spano , Mathew J. Palazola , William A. Izzicupo , James M. Carney , Daniel D. Gonsalves , Mark R. Pugliese
CPC分类号： H01R23/661
摘要： An apparatus for securing a conductor to a circuit board. The conductor is configured for being soldered to the circuit board through a first aperture in the board. The apparatus includes a conductor supporting portion having a second aperture therethrough. The conductor supporting portion is configured for coupling to the circuit board. The second aperture substantially aligns with the first aperture when the conductor supporting portion is coupled to the circuit board to permit the conductor to be inserted through both the first aperture and the second aperture. The apparatus includes a tab portion configured for coupling to the conductor supporting portion. A portion of the conductor is thus held substantially immobile between the conductor supporting portion and a first edge of the tab portion when the tab portion is coupled with the conductor supporting portion, thereby preventing the conductor from being broken at the portion of the conductor when the conductor is flexed.
摘要翻译： 一种用于将导体固定到电路板的装置。 导体被配置为通过板中的第一孔焊接到电路板。 该装置包括具有穿过其中的第二孔的导体支撑部分。 导体支撑部分被配置为耦合到电路板。 当导体支撑部分耦合到电路板时，第二孔基本上与第一孔对准，以允许导体插入穿过第一孔和第二孔。 该装置包括被配置为联接到导体支撑部分的突片部分。 因此，当突片部分与导体支撑部分联接时，导体的一部分因此在导体支撑部分和突片部分的第一边缘之间基本上不能移动，从而防止导体在导体部分处被破坏 导体弯曲。
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公开(公告)号：US6141213A
公开(公告)日：2000-10-31
申请号：US882317
申请日：1997-06-24
申请人： Robert S. Antonuccio , Thomas E. Stewart , Joseph M. Spano , Mathew J. Palazola , William A. Izzicupo , James M. Carney , Daniel D. Gonsalves , Mark R. Pugliese
发明人： Robert S. Antonuccio , Thomas E. Stewart , Joseph M. Spano , Mathew J. Palazola , William A. Izzicupo , James M. Carney , Daniel D. Gonsalves , Mark R. Pugliese
摘要： The invention relates to a computer system and method thereof characterized by high airflow and low acoustic noise by separating the enclosure of the system into two sections, in which in one section cooling fans are arranged between power supply units and disk drives, the power supply units being located at the back of the section and the fans, as to the disk drives, serving as exhaust fans, and in the other section inlet fans are arranged to cool selected hardware electrical elements, such as CPU modules, PCI and graphics cards, wherein the placement of the inlet fans is selected to minimize pre-heated air and fan airflow paths are controlled and directed by an air dam to maximize the cooling effect, and noise damping material is employed in mounting the rack for the disk drives, the disk drives and fans and in forming the side walls of the enclosure.
摘要翻译： 本发明涉及一种计算机系统及其方法，其特征在于将系统的外壳分为两部分，其中一个部分中的冷却风扇布置在电源单元和磁盘驱动器之间，具有高气流和低噪声，电源单元 位于该部分的背面和风扇，作为用作排气风扇的磁盘驱动器，并且在另一部分中，入口风扇被布置成冷却诸如CPU模块，PCI和图形卡的所选硬件电气元件，其中 选择入口风扇的放置以使预热的空气最小化，并且风扇气流路径由空气坝控制和引导以最大化冷却效果，并且在安装用于磁盘驱动器的机架中使用噪声阻尼材料，磁盘驱动器 风扇和形成外壳的侧壁。
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公开(公告)号：US5434746A
公开(公告)日：1995-07-18
申请号：US182440
申请日：1994-01-13
申请人： James Testa , Joseph M. Spano , William L. Dailey , Daniel D. Gonsalves , Robert S. Antonuccio , James M. Carney , Mathew J. Palazola
发明人： James Testa , Joseph M. Spano , William L. Dailey , Daniel D. Gonsalves , Robert S. Antonuccio , James M. Carney , Mathew J. Palazola
CPC分类号： H05K7/1417
摘要： An improved attachment mechanism for attaching the motherboard in a computer system to its chassis is disclosed. The attachment mechanism includes a rail that engages at least two opposing edges of the motherboard and a hook mechanism that engages a catch formed in the chassis. The hook mechanism is secured to a central portion of the motherboard. The rail and hook mechanism cooperate to securely couple the motherboard to the chassis without requiting the use of extensive usable space on the motherboard. The described arrangement permits the motherboard to be quickly and easily installed and released.
摘要翻译： 公开了一种用于将计算机系统中的主板连接到其底盘的改进的附接机构。 附接机构包括接合母板的至少两个相对边缘的轨道和接合形成在底盘中的挡块的钩机构。 钩机构固定到母板的中心部分。 轨道和钩子机构配合以将主板牢固地连接到底盘，而不需要在主板上使用广泛的可用空间。 所述的布置允许主板快速且容易地安装和释放。
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4.发明授权公开(公告)号：US06239592B1
公开(公告)日：2001-05-29
申请号：US09324414
申请日：1999-06-02
申请人： James M. Carney , Yvetta D. Pols , Robert S. Antonuccio , Joseph M. Spano , William A. Izzicupo , Timothy M. Holland , Lewis B. Sheen, III , Joseph J. Montagna , Daniel D. Gonsalves
发明人： James M. Carney , Yvetta D. Pols , Robert S. Antonuccio , Joseph M. Spano , William A. Izzicupo , Timothy M. Holland , Lewis B. Sheen, III , Joseph J. Montagna , Daniel D. Gonsalves
IPC分类号： G01R104
摘要： A test fixture which holds multiple circuit boards in an edge-to-edge configuration for testing includes a sliding interconnect mechanism which is located between the circuit boards under test. The interconnect mechanism includes an interconnect board on which are mounted pairs of inter-wired frame connectors which mate with the connectors on each of the printed circuit boards to be tested and electrically interconnect the boards. The interconnect mechanism includes guide pins on which the interconnect mechanism slides to accurately align the frame and board connectors and an actuating mechanism to move the interconnect mechanism into position to securely mate the aligned connectors. The actuating mechanism can also be reversed to unmate the connectors and release the boards under test after the tests are completed.
摘要翻译： 用于测试的边缘到边缘配置中保持多个电路板的测试夹具包括位于被测电路板之间的滑动互连机构。 互连机构包括互连板，其上安装有成对的互连线框架连接器，其与待测试的每个印刷电路板上的连接器配合，并且电连接板。 互连机构包括引导引脚，互连机构在其上滑动以精确地对准框架和板连接器以及致动机构以将互连机构移动到适当位置，以使对准的连接器牢固地配合。 在完成测试之后，也可以将启动机构反转，使连接器脱离并释放被测试的板。
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公开(公告)号：US06392893B1
公开(公告)日：2002-05-21
申请号：US09708355
申请日：2000-11-08
申请人： James M. Carney , Robert S. Antonuccio , Timothy M. Holland , Daniel D. Gonsalves , Joseph J. Montagna
发明人： James M. Carney , Robert S. Antonuccio , Timothy M. Holland , Daniel D. Gonsalves , Joseph J. Montagna
IPC分类号： H05K714
CPC分类号： H05K7/20172
摘要： A method and apparatus relating to a support bracket (18) enabling hot-swapping of component trays (16) in component racks (10) is disclosed. A bracket (18) is provided for removably mounting a tray (16) in a component rack (10). The bracket (18) has two guide channels (20) extending substantially from a front end of the bracket (18) through to a back end. The guide channel (20) is adapted for sliding engagement with the component carrying tray (16). In addition, there is at least one stop guide (30) that projects from each of the front and back ends of the bracket (18). This stop guide (30) aids in positioning the bracket (18) during installation. On a backside of the bracket (18), there is a detent (32) that projects outward. The detent (32) serves as an aid in positioning and releasably holding the bracket (18) in place during installation. The configuration of the bracket (18) allows it to be used as either a bottom bracket (18) or a top bracket (18) for mounting a tray (16), without any additional modifications.
摘要翻译： 公开了一种与支撑托架（18）相关的方法和装置，其能够在部件托架（10）中进行部件托盘（16）的热插拔。 一个托架（18）用于可拆卸地将托盘（16）安装在组件架（10）中。 支架（18）具有基本上从支架（18）的前端延伸到后端的两个引导通道（20）。 引导通道（20）适于与部件传送托盘（16）滑动接合。 此外，还有至少一个从支架（18）的前端和后端中的每一个伸出的止动导轨（30）。 该止动引导件（30）有助于在安装期间定位支架（18）。 在支架（18）的背面，有一个向外突出的棘爪（32）。 止动件（32）用于在安装期间定位和可释放地将支架（18）保持在适当位置。 支架（18）的构造允许其用作用于安装托盘（16）的底托架（18）或顶托架（18），而无需任何其他修改。
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6.发明授权Apparatus for dissipating heat from a circuit board having a multilevel surface 失效用于从具有多层表面的电路板散热的装置公开(公告)号：US06212074B1
公开(公告)日：2001-04-03
申请号：US09495164
申请日：2000-01-31
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： For a circuit board populated with numerous components having different heights, the need for numerous individual heatsinks to accommodate the circuit board's multilevel surface is eliminated. Instead, heat is transferred to a single integral heatsink via a thermal-conductive material (i.e., a thermal phase change material and/or a resilient gap filling material). A fastener secures the thermal-conductive material between the bottom portion of the heatsink and the multilevel surface, and compresses the thermal-conductive material therein, creating a thermal path sufficient to transfer heat from the multilevel surface to the heatsink so that the circuit board operates within specified design parameters.
摘要翻译： 对于具有不同高度的许多部件的电路板，消除了用于容纳电路板的多电平表面的多个单独的散热器的需要。 相反，热量通过导热材料（即，热相变材料和/或弹性间隙填充材料）转移到单个整体散热器。 紧固件将导热材料固定在散热器的底部和多层表面之间，并将其中的导热材料压缩，产生足以将热量从多层表面传递到散热器的热路径，使得电路板操作 在规定的设计参数内。
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公开(公告)号：USD434030S
公开(公告)日：2000-11-21
申请号：US108258
申请日：1999-07-22
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公开(公告)号：US06377459B1
公开(公告)日：2002-04-23
申请号：US09632306
申请日：2000-08-04
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of the heat pipe attaches to the heat sink and the other end of the heat pipe attaches to the plate member. A system for cooling chips and method for dissipating heat generated by chips are also disclosed.
摘要翻译： 公开了一种用于冷却芯片的冷却组件。 组件包括散热器，板构件和热管。 散热器可连接到第一芯片。 板构件可附接到第二芯片。 热管布置在散热器和板构件之间，使得热管的一端附接到散热器，并且热管的另一端附接到板构件。 还公开了一种用于冷却芯片的系统和用于散发由芯片产生的热量的方法。
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公开(公告)号：US20140079257A1
公开(公告)日：2014-03-20
申请号：US13617254
申请日：2012-09-14
CPC分类号： H04R5/033 , F21V21/084 , H04R1/028 , H04R1/1025 , H04R1/1091 , H04R2420/03 , H04S7/304
摘要： A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector. One or more accessory circuits is provided by the device, including a lamp configured to direct light onto a surface external to the device or a position detection circuit usable to adjust three-dimensional audio signals to account for the direction the user is looking.
摘要翻译： 用于耦合到耳机的耳罩上的连接器的装置包括对应于耳机的连接器的匹配连接器。 配合连接器包括耦合到配合连接器内的第一和第二端子的交叉导体。 该设备提供一个或多个附件电路，包括配置成将光引导到设备外部的表面上的灯或可用于调节三维音频信号以解决用户正在观看的方向的位置检测电路的灯。
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公开(公告)号：US5927389A
公开(公告)日：1999-07-27
申请号：US880033
申请日：1997-06-20
申请人： Daniel D. Gonsalves , Robert Antonuccio , William Izzicupo , James Carney , Mark Pugliese , Joseph Spano , Matthew Palazola , David Desilets
发明人： Daniel D. Gonsalves , Robert Antonuccio , William Izzicupo , James Carney , Mark Pugliese , Joseph Spano , Matthew Palazola , David Desilets
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , Y10T403/606
摘要： A computer housing or electronic apparatus frame (10) includes a compartment (12) that provides space for mounting a fan assembly (14) or similar component. The fan assembly (14) is mounted on a fan tray support (16), which is removably mountable within the computer housing (10) by means of the fan tray mounts (18). Fan tray mounts (18) are oriented facing one another so that side rails (22) of fan tray (16) are slidably received by the fan tray mounts (18). The fan tray mounts (18) further includes an elongated guide channel (31) that extends the length of the fan tray mount and is formed in the inside face (30) thereof. The fan tray mounts (18) also include a first, outwardly projecting stop (52) that is positioned inwardly from end wall (38) and a second, outwardly-projecting, resiliently-deflectable stop and latch lever (54) provided adjacent end wall (36). The first stop (52) and the second stop and latch (54) cooperate with tabs (84, 88) on the fan tray (16) to releasably latch the fan tray (16) in a predetermined position along the guide channel (31). The fan tray mounts (18) further include a pair of cantilevered spring arms (60, 62), which bias the fan tray (16) in a direction away from the guide channel (31) to minimize vibration transmission to the computer housing (10).
摘要翻译： 计算机外壳或电子设备框架（10）包括提供用于安装风扇组件（14）或类似部件的空间的隔室（12）。 风扇组件（14）安装在风扇盘支架（16）上，风扇盘支架（16）可借助于风扇盘安装件（18）可移除地安装在计算机壳体（10）内。 风扇托盘安装件（18）彼此面对，使得风扇盘（16）的侧轨（22）可滑动地被风扇盘安装件（18）容纳。 风扇盘安装件（18）还包括延长风扇盘安装件的长度并形成在其内表面（30）中的细长引导通道（31）。 风扇盘安装件（18）还包括从端壁（38）向内定位的第一向外突出的止动件（52）和邻近端壁（38）设置的第二向外突出的可弹性偏转的止动和锁定杆（54） （36）。 第一止动件（52）和第二止动件和闩锁件（54）与风扇盘（16）上的突出部（84,88）配合，以将风扇盘（16）可释放地沿着引导通道（31）锁定在预定位置， 。 风扇盘安装件（18）还包括一对悬臂式弹簧臂（60,62），其沿远离引导通道（31）的方向偏压风扇盘（16），以最小化到计算机壳体（10）的振动传递 ）。
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