摘要:
A TANK filter is provided for a lead wire of an active medical device (AMD). In a preferred form, the TANK filter is integrated into a TIP and/or RING electrode for an active implantable medical device. The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency to attenuate current flow through the lead wire along a range of selected frequencies. In a particularly preferred form, the TANK filter is manufactured using very low k materials of sufficient strength to handle forces applied thereto during installation and use.
摘要:
The self-resonance insertion loss dip of a feedthrough capacitor is reduced or eliminated by raising the equivalent series resistance of the capacitor, thus minimizing the capacitor Q. The equivalent series resistance of the capacitor can be raised by forming voids in the active and/or ground electrode plates of the capacitor. The electrode plates may be formed so as to have a relatively reduced thickness, or a relatively increased thickness. A conductive material having a relatively high resistivity may be used to form the active and/or ground electrode plates of the capacitor. Alternatively, the conductive material forming the electrode plates may have a dielectric material added thereto.
摘要:
A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. In a preferred form, the TANK filter reduces or even eliminates the use of ferro-magnetic materials, and instead uses non-ferromagnetic materials so as to reduce or eliminate MRI image artifacts or the force or torque otherwise associated during an MRI image scan.
摘要:
A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the TANK filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the TANK filter is integrated into a TIP and/or RING electrode for an active implantable medical device.
摘要:
In an electromagnetic interference (EMI) filter terminal for an active implantable medical device (AIMD), an insulated and shielded RF telemetry pin is provided to prevent re-radiation of unwanted stray signals, including the telemetry signal itself, to adjacent sensitive circuits or lead wires. The invention provides for an EMI filter terminal assembly for an AIMD including a radio frequency (RF) telemetry pin antenna extending therethrough. The RF telemetry pin antenna includes a conductive shield extending over a portion of the RF telemetry pin antenna in non-conductive relation with the telemetry pin, and conductively connected to a ground associated with the AIMD. The assembly may also include an insulation tube between the RF telemetry pin antenna and the conductive shield covering a portion of the RF telemetry pin antenna.
摘要:
A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.
摘要:
A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.
摘要:
A feedthrough terminal assembly for an active implantable medical device utilizes an insert to establish a reliable electrical connection between capacitor electrode plates, via inner surface metallization of a capacitor aperture, and an associated terminal pin 10, which passes at least partially therethrough. The inserts are preferably resiliently flexible, such as a spring, to establish this connection. The insert also serves to establish a mechanical connection between the capacitor and the terminal pin.
摘要:
A feedthrough terminal assembly for an active implantable medical device includes a conductive terminal pin or leadwire, a feedthrough filter capacitor having a first set of electrode plates conductively coupled to the terminal pin or leadwire, and a second set of electrode plates conductively coupled to a housing, ferrule or ground plane of the active implantable medical device, and a non-conductive mullion disposed relative to the terminal pin or leadwire for increasing creepage distance between the terminal pin or leadwire and another conductive element, creating a tortuous path that increases resistance to arcing/flashover.
摘要:
An EMI filter capacitor assembly utilizes biocompatible and non-migratable materials to adapt electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials. Layers of glass may be disposed over surfaces of the assembly, including the capacitor.