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公开(公告)号：US20240355546A1
公开(公告)日：2024-10-24
申请号：US18760091
申请日：2024-07-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinobu CHIKUMA
CPC classification number: H01G4/252 , H01G2/065 , H01G4/1227 , H01G4/30
Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes each on a corresponding one of end surfaces in a length direction perpendicular or substantially perpendicular to a lamination direction of the multilayer body, and each connected to the internal electrode layers. A surface, in a plan view in the length direction, of each of the external electrodes is covered with an insulating layer except for a frame region having a width of about 1 μm or more and about 100 μm or less from an outer peripheral edge of the surface.
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公开(公告)号：US20240212935A1
公开(公告)日：2024-06-27
申请号：US18124713
申请日：2023-03-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hiroki OKADA , Jong Rock LEE , Jun Il KANG , Hee Jung JUNG , Chung Yeol LEE , Cheong KIM
CPC classification number: H01G4/2325 , H01G4/224 , H01G4/252 , H01G4/30
Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer between the internal electrodes, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the body; and a first inorganic material, including at least one inorganic material among sulfur (S) and fluorine (F), disposed in at least a portion between the body and the external electrodes.
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公开(公告)号：US11990285B2
公开(公告)日：2024-05-21
申请号：US17438105
申请日：2020-02-19
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Riki Suemasa , Takayuki Sekiguchi
CPC classification number: H01G4/35 , H01G4/12 , H01G4/232 , H05K1/181 , H01G4/252 , H01G4/33 , H05K2201/10015
Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.
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4.发明公开公开(公告)号：US20230223194A1
公开(公告)日：2023-07-13
申请号：US18174598
申请日：2023-02-24
Inventor： HIROKI TAKEOKA , TAKAYUKI HATTORI , YUKIHIRO SHIMASAKI
Abstract: An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.
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公开(公告)号：US11688555B2
公开(公告)日：2023-06-27
申请号：US17137498
申请日：2020-12-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukihiro Fujita , Shogo Kanbe , Kosuke Nakano , Hideki Otsuka
Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
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Patent Agency Ranking
公开(公告)号：US20190074138A1
公开(公告)日：2019-03-07
申请号：US16008865
申请日：2018-06-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Woo SONG , Taek Jung LEE , Jin Kyung JOO , Hyo Youn LEE , Sung Kwon AN
CPC classification number: H01G4/236 , H01G4/008 , H01G4/012 , H01G4/1227 , H01G4/232 , H01G4/2325 , H01G4/252 , H01G4/30
Abstract: A multilayer ceramic capacitor includes a body a first internal electrode and a second internal electrode disposed with a dielectric layer interposed therebetween, a first connecting electrode connected to the first internal electrode through the body, a second connecting electrode connected to the second internal electrode through the body, a first external electrode disposed on one surface of the body and connected to the first connecting electrode, and a second external electrode disposed on one surface of the body, spaced apart from the first external electrode, and connected to the second connecting electrode, wherein the first and second external electrodes each include a first electrode layer disposed on the body and including ceramics, and a second electrode layer disposed on the first electrode layer and having the content of ceramics smaller than that of the first electrode layer.
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公开(公告)号：US09324499B2
公开(公告)日：2016-04-26
申请号：US13168879
申请日：2011-06-24
Applicant: Ali Moalemi , Euan Patrick Armstrong
Inventor： Ali Moalemi , Euan Patrick Armstrong
CPC classification number: H01G4/252 , H01G4/228 , H01G4/232 , Y10T29/435
Abstract: A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body.
Abstract translation: 一种高电容单层陶瓷电容器结构，其具有陶瓷电介质体，该陶瓷电介质体包含一个或多个电连接到施加到侧表面和底表面的金属化层的内部电极以及与金属化侧电绝缘的金属化焊盘和位于顶表面 的陶瓷体。
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公开(公告)号：US20140321025A1
公开(公告)日：2014-10-30
申请号：US14324325
申请日：2014-07-07
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Akira Saito , Makoto Ogawa , Akihiro Motoki
IPC: H01G4/252
CPC classification number: H01G4/252 , C25D3/14 , C25D3/30 , C25D5/12 , C25D5/505 , C25D17/16 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn—Ni alloy flakes therein, the Sn—Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn—Ni alloy flakes, an observed planar view of a region occupied by the Sn—Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.
Abstract translation: 一种电子部件，包括具有外部电极的电子部件元件，外部电极上的Ni镀膜，以及覆盖Ni镀膜的Sn镀覆膜。 Sn镀膜在其中具有Sn-Ni合金薄片，Sn-Ni合金薄片存在于Ni镀膜上的Sn镀覆膜的表面至Sn镀膜厚度的50％以下的范围内， 当Sn从Sn镀膜中除去仅留下Sn-Ni合金薄片时，Sn-Ni合金薄片占据的区域的观察平面图落在观察到的平面区域的15％〜60％的范围内 。
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公开(公告)号：US07570477B2
公开(公告)日：2009-08-04
申请号：US12261144
申请日：2008-10-30
Applicant: Takayuki Kayatani
Inventor： Takayuki Kayatani
CPC classification number: H01G13/006 , H01G4/2325 , H01G4/252 , H01G4/30
Abstract: In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced.
Abstract translation: 在陶瓷电子部件中，导电性树脂层被设置为覆盖厚膜层并且延伸超过厚膜层的端部至少约100μm，并且布置覆盖导电树脂层的镀层，除了 具有至少约50μm的尺寸并且沿着导电树脂层的端部延伸的区域。 因此，应力的浓度降低。
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公开(公告)号：US20060050467A1
公开(公告)日：2006-03-09
申请号：US10529551
申请日：2003-10-09
Applicant: Kohei Shiota , Toshiharu Saito , Hiroki Takeoka
Inventor： Kohei Shiota , Toshiharu Saito , Hiroki Takeoka
IPC: H01G4/005
Abstract: A metallized-film capacitor includes a slit (5a) at approx. center of the width (W) of an effective electrode which actually forms a capacitance of a pair of deposited electrodes (110, 210). Divisional electrodes (2a, 2b) exist at a place between the center and insulation margins (4a, 4b), and the electrodes (2a, 2b) are coupled in parallel to each other by fuses (7a, 7b) disposed away from metallized contacts (6a, 6b). Such a structure as placing fuses (7a, 7b) away from the contacts (6a, 6b) allows reducing a current supplied from the contacts (6a, 6b) and running through fuses (7a, 7b), thereby lowering heat generated from fuses (7a, 7b). As a result, a temperature rise in the metallized-film capacitor can be suppressed.
Abstract translation: 金属化薄膜电容器包括一个约5cm的狭缝（5a）。 实际形成一对沉积电极（110,210）的电容的有效电极的宽度（W）的中心。 分隔电极（2a，2b）存在于中心和绝缘边缘（4a，4b）之间的位置处，并且电极（2a，2b）通过熔丝（7a， 7）远离金属化触点（6a，6b）放置。 将熔断器（7a，7b）放置在远离触点（6a，6b）的这种结构允许减少从触头（6a，6b）供给并通过熔断器（7a，7b）运行的电流， ，从而降低从保险丝（7a，7b）产生的热量。 结果，能够抑制金属化膜电容器的温度上升。
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