公开(公告)号：US4003073A

公开(公告)日：1977-01-11

申请号：US296186

申请日：1972-10-10

申请人： Robert W. Helda ,  Harry J. Geyer

发明人： Robert W. Helda ,  Harry J. Geyer

IPC分类号： H01L21/607 ,  H01L23/057 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L23/30

CPC分类号： H01L23/49541 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49524 ,  H01L24/86 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a plurality of inwardly extending leads. A single-step vibratory pressure welding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the leads during the bonding steps causes a buckling action to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.

摘要翻译： 通过涉及将电路电极直接接合到具有多个向内延伸的引线的未支撑的金属片框架构件的工艺，在微电子器件的组装中消除引线接合。 采用单步振动压焊技术将所有引线同时连接到半导体集成电路芯片。 在接合步骤期间引线的横向限制导致弯曲作用，以在每个引线中引入小但关键的环，以确保引线指与半导体芯片的周边之间的间隙，从而避免电短路。 该回路还在引线中提供了结构灵活性，这倾向于保护结合部位免受过大的应力。 随后，包括接合电路的第一框架构件优选地通过电阻焊接被附接到较重的规格的第二引线框架构件并且具有适于与外部电路连接的尺寸。 然后移除第一框架构件的多余部分，提供用于包装的完整组件; 例如塑料封装或气密密封，如陶瓷 - 玻璃扁平封装。

公开(公告)号：US4028722A

公开(公告)日：1977-06-07

申请号：US296185

申请日：1972-10-10

申请人： Robert W. Helda

发明人： Robert W. Helda

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L29/44

CPC分类号： H01L23/49541 ,  H01L23/49524 ,  H01L23/49537 ,  H01L24/01 ,  H01L2924/09701 ,  H01L2924/14

摘要： Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to a metallic sheet-frame member having a plurality of inwardly extending leads. A single-step bonding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the lead frame member during the bonding steps causes a buckling action in the lead fingers, to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.

摘要翻译： 通过涉及将电路电极直接接合到具有多个向内延伸的引线的金属片框构件的工艺，在微电子器件的组装中消除了引线接合。 采用单步接合技术将所有引线同时连接到半导体集成电路芯片。 在接合步骤期间引线框架构件的侧向限制导致引线指中的弯曲作用，以在每个引线中引入小但关键的环，以确保引线指与半导体芯片的周边之间的间隙，由此避免电短路 。 该回路还在引线中提供了结构灵活性，这倾向于保护结合部位免受过大的应力。 随后，包括接合电路的第一框架构件优选地通过电阻焊接被附接到较重的规格的第二引线框架构件并且具有适于与外部电路连接的尺寸。 然后移除第一框架构件的多余部分，提供用于包装的完整组件; 例如塑料封装或气密密封，如陶瓷 - 玻璃扁平封装。