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    Electronic assembly having spring-loaded contact bridge with fuse function
    2.
    发明授权
    Electronic assembly having spring-loaded contact bridge with fuse function 有权
    电子组件具有带保险丝功能的弹簧加载接触桥

    公开(公告)号：US07864024B2

    公开(公告)日：2011-01-04

    申请号：US11886755

    申请日：2006-03-28

    申请人： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    发明人： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    IPC分类号： H01H85/36 ,  H01H37/76

    CPC分类号： H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

    摘要： An electronic assembly includes an electronic circuit on a circuit board. The circuit includes a conductor path on the circuit board, and at least one SMD component, electronic component and/or electromechanical component that is mounted on the circuit board and connected to the conductor path. A circuit connection between any two of the conductor paths and/or the components is established via a soldered joint and a spring-loaded contact bridge. In the event of excessive power dissipation, the soldered joint melts or weakens and the contact bridge opens due to the spring force.

    摘要翻译： 电子组件包括电路板上的电子电路。 该电路包括电路板上的导体路径，以及安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载的接触桥来建立任何两个导体路径和/或部件之间的电路连接。 在功率过大的情况下，由于弹簧力，焊接接头熔化或变弱，接触桥打开。

    Electronic Assembly
    3.
    发明申请
    Electronic Assembly 有权
    电子组装

    公开(公告)号：US20090027156A1

    公开(公告)日：2009-01-29

    申请号：US11886755

    申请日：2006-03-28

    申请人： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    发明人： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    IPC分类号： H01H37/76

    CPC分类号： H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

    摘要： An electronic assembly (1) with a circuit board (2) that is provided with conductor paths or strips (6) and, for forming an electronic circuit, is equipped with a number of SMD components (4) and/or further electronic and/or electromechanical elements through use of a suitable solder, shall be secured with simple means against high power dissipation. For that purpose, according to the invention, a number of connections between conductor strips (6), components and/or elements is produced via respectively one spring-loaded contact bridge (12, 12′, 12″, 12′″).

    摘要翻译： 具有设置有导体路径或条带（6）的电路板（2）和用于形成电子电路的电子组件（1）配备有多个SMD部件（4）和/或电子和/ 或通过使用合适的焊料的机电元件，应通过简单的手段确保高功率消耗。 为此，根据本发明，导体条（6），部件和/或元件之间的多个连接分别通过一个弹簧加载的接触桥（12,12'，12“，12”'） 。

    Printed board for electronic devices controlling a motor vehicle
    4.
    发明申请
    Printed board for electronic devices controlling a motor vehicle 审中-公开
    用于控制汽车的电子设备的印刷电路板

    公开(公告)号：US20060102385A1

    公开(公告)日：2006-05-18

    申请号：US10517948

    申请日：2003-06-14

    申请人： Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

    发明人： Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

    IPC分类号： H05K1/09 ,  H01H85/04

    CPC分类号： H05K1/0293 ,  H01H37/761 ,  H01H85/046 ,  H01H85/463 ,  H01H2037/046 ,  H01H2085/0275 ,  H05K1/0263 ,  H05K2201/0305 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2203/0415 ,  H05K2203/173

    摘要： In order to protect a printed circuit board (1, 1′) especially against the development of heat by simple means, said printed circuit board includes strip conductors for electronic circuits and connections for a voltage supply unit equipped with at least one SMD-component and additional electronic and/or electromechanical parts that are soldered in a suitable manner. The voltage supply unit is connected to one or several supplying strip conductors (2). At least one of the supplying strip conductors (2) includes a break to this end which is bridged in a conductive manner by means of a fuse bridge (6), said fuse bridge (6) containing or being made of a basic material, the melting point of which is lower than the melting point of the material of which the strip conductors are made.

    摘要翻译： 为了通过简单的手段特别地防止印刷电路板（1,1'）保护发热，所述印刷电路板包括用于电子电路的带状导体和用于具有至少一个SMD分量和 额外的电子和/或机电零件以适当的方式焊接。 电压供应单元连接到一个或多个供电条导体（2）。 供电带状导体（2）中的至少一个包括通过熔丝桥（6）以导电方式桥接的该端部的断裂，所述熔断器桥（6）包含或由基本材料制成， 其熔点低于制造带状导体的材料的熔点。