公开(公告)号：US20140139314A1

公开(公告)日：2014-05-22

申请号：US13682270

申请日：2012-11-20

申请人： TYCO ELECTRONICS CORPORATION

发明人： Johnny Lam ,  Martyn A. Matthiesen ,  Matthew P. Galla ,  Jianhua Chen

IPC分类号： H01H37/02

CPC分类号： H01H85/463 ,  H01H37/76 ,  H01H37/761 ,  H01H2085/0275 ,  H01H2085/466

摘要： A fuse includes first, second, and third terminals disposed on a substrate. Respective ends of one or more primary conductors of the fuse are connected to one of the first and the second terminals. The primary conductors have a first conductivity and are configured to open when a primary current between the first and the second terminals exceeds a first predetermined threshold. One or more secondary conductors have an end connected to the third terminal. The secondary conductors are configured to ignite when a secondary current through the secondary conductors exceeds a second predetermined threshold. When ignited, the secondary conductors open the primary conductors to thereby stop the primary current.

摘要翻译： 保险丝包括设置在基板上的第一，第二和第三端子。 保险丝的一个或多个主导体的相应端部连接到第一和第二端子中的一个。 主导体具有第一导电性并且被配置为当第一和第二端子之间的初级电流超过第一预定阈值时打开。 一个或多个次级导体的端部连接到第三端子。 次级导体被配置为当通过次级导体的次级电流超过第二预定阈值时点燃。 当点火时，次级导体打开主导体，从而停止初级电流。

公开(公告)号：US08364259B2

公开(公告)日：2013-01-29

申请号：US12952554

申请日：2010-11-23

申请人： William J. Linder ,  Ron A. Balczewski ,  Jacob M. Ludwig

发明人： William J. Linder ,  Ron A. Balczewski ,  Jacob M. Ludwig

IPC分类号： A61N1/39

CPC分类号： A61N1/3931 ,  A61N1/3956 ,  H01H85/0078 ,  H01H85/0095 ,  H01H85/046 ,  H01H85/463

摘要： An implantable medical device may have a circuit failure mode. The disclosed circuit may have an integrated failure point designed to fail prior to those portions of the circuit. The integrated failure point may include a narrowed portion of a high voltage lead and a grounded lead having a narrow gap separating the grounded lead from the narrowed portion of the high voltage lead. During a high stress fault condition the narrowed portion of the high voltage lead acts as a fuse, forming a vaporized cloud of metal, which shorts current in the high voltage lead across the narrow gap to the grounded lead, thus protecting the remaining portion of the circuit from the high stress condition.

摘要翻译： 可植入医疗装置可具有电路故障模式。 所公开的电路可以具有设计成在电路的那些部分之前故障的集成故障点。 集成的故障点可以包括高压引线的窄部分和具有将接地引线与高压引线的变窄部分分开的窄间隙的接地引线。 在高应力故障条件下，高压引线的变窄部分作为保险丝，形成蒸发的金属云，将高压引线上的电流短路到窄接地引线上，从而保护 电路从高应力状态。

公开(公告)号：US20120112871A1

公开(公告)日：2012-05-10

申请号：US13291884

申请日：2011-11-08

申请人： Kuo-Shu CHEN ,  Chung-Hsiung WANG

发明人： Kuo-Shu CHEN ,  Chung-Hsiung WANG

IPC分类号： H01H85/044

CPC分类号： H01H85/044 ,  H01H69/02 ,  H01H69/022 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/055 ,  H01H85/463

摘要： A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.

摘要翻译： 保护装置包括基板，两个第一电极，低熔点金属层和辅助层。 第一电极分别布置在基板的两个相对侧。 低熔点金属层布置在两个第一电极上。 辅助层形成在低熔点金属层上。 辅助层的液相线温度低于低熔点金属层的液相线温度，辅助层的液相线温度不低于低于回流焊接工艺的最高工作温度25度的预定温度。

公开(公告)号：US07760482B2

公开(公告)日：2010-07-20

申请号：US11555112

申请日：2006-10-31

申请人： Farshid Tofigh ,  Otmar Kruppa ,  Jesse Thomas Chen

发明人： Farshid Tofigh ,  Otmar Kruppa ,  Jesse Thomas Chen

IPC分类号： H02H5/04

CPC分类号： H01H85/0047 ,  H01H85/046 ,  H01H85/463 ,  H01H2085/466 ,  H02H5/041

摘要： The present invention relates to a power control system with a fusible link. In one embodiment, the invention relates to a power control system, having a device possessing an output, a fusible link connected to the output of the device, a heating element controller, and at least one heating element connected to the heating element controller, where the heating element controller is configured to control the flow of current through the heating element, where the heating element controller is configured to monitor activity of the device, and where the heating element is configured to generate sufficient heat to fuse the fusible link within a predetermined time period when current flows through the heating element.

摘要翻译： 本发明涉及具有可熔链路的功率控制系统。 在一个实施例中，本发明涉及一种功率控制系统，其具有具有输出的装置，连接到该装置的输出的可熔连接件，加热元件控制器和连接到加热元件控制器的至少一个加热元件，其中 加热元件控制器被配置为控制通过加热元件的电流流动，其中加热元件控制器被配置为监测设备的活动，并且其中加热元件被配置为产生足够的热量以将可熔链路熔化在预定的 电流流过加热元件的时间段。

公开(公告)号：US20080100411A1

公开(公告)日：2008-05-01

申请号：US11555112

申请日：2006-10-31

申请人： Farshid Tofigh ,  Otmar Kruppa ,  Jesse Thomas Chen

发明人： Farshid Tofigh ,  Otmar Kruppa ,  Jesse Thomas Chen

IPC分类号： H01H85/02 ,  H01H85/04

CPC分类号： H01H85/0047 ,  H01H85/046 ,  H01H85/463 ,  H01H2085/466 ,  H02H5/041

摘要： The present invention relates to a power control system with a fusible link. In one embodiment, the invention relates to a power control system, having a device possessing an output, a fusible link connected to the output of the device, a heating element controller, and at least one heating element connected to the heating element controller, where the heating element controller is configured to control the flow of current through the heating element, where the heating element controller is configured to monitor activity of the device, and where the heating element is configured to generate sufficient heat to fuse the fusible link within a predetermined time period when current flows through the heating element.

摘要翻译： 本发明涉及具有可熔链路的功率控制系统。 在一个实施例中，本发明涉及一种功率控制系统，其具有具有输出的装置，连接到该装置的输出的可熔连接件，加热元件控制器和连接到加热元件控制器的至少一个加热元件，其中 加热元件控制器被配置为控制通过加热元件的电流流动，其中加热元件控制器被配置为监测设备的活动，并且其中加热元件被配置为产生足够的热量以将可熔链路熔化在预定的 电流流过加热元件的时间段。

公开(公告)号：US07116208B2

公开(公告)日：2006-10-03

申请号：US11062297

申请日：2005-02-17

申请人： Kohshi Nishimura ,  Satoshi Nakamura ,  Saizou Suzuki

发明人： Kohshi Nishimura ,  Satoshi Nakamura ,  Saizou Suzuki

IPC分类号： H01H85/08 ,  H01H85/48

CPC分类号： H01H85/046 ,  H01H85/0047 ,  H01H85/0411 ,  H01H85/463 ,  H01H2069/027 ,  H01H2085/0275 ,  H05K1/0272 ,  H05K1/0293 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2203/049

摘要： A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).

摘要翻译： 印刷布线板包括其上形成有布线图案（12）的基板（20）和设置在基板（20）上的熔丝（6）。 保险丝（6）的一端直接连接到布线图案（12）的第一焊盘（12a），并且熔丝（6）的另一端直接连接到第二焊盘（12b） 布线图案（12）。 保险丝（6）被保护材料（7）覆盖。

公开(公告)号：US20060102385A1

公开(公告)日：2006-05-18

申请号：US10517948

申请日：2003-06-14

申请人： Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

发明人： Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

IPC分类号： H05K1/09 ,  H01H85/04

CPC分类号： H05K1/0293 ,  H01H37/761 ,  H01H85/046 ,  H01H85/463 ,  H01H2037/046 ,  H01H2085/0275 ,  H05K1/0263 ,  H05K2201/0305 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2203/0415 ,  H05K2203/173

摘要： In order to protect a printed circuit board (1, 1′) especially against the development of heat by simple means, said printed circuit board includes strip conductors for electronic circuits and connections for a voltage supply unit equipped with at least one SMD-component and additional electronic and/or electromechanical parts that are soldered in a suitable manner. The voltage supply unit is connected to one or several supplying strip conductors (2). At least one of the supplying strip conductors (2) includes a break to this end which is bridged in a conductive manner by means of a fuse bridge (6), said fuse bridge (6) containing or being made of a basic material, the melting point of which is lower than the melting point of the material of which the strip conductors are made.

摘要翻译： 为了通过简单的手段特别地防止印刷电路板（1,1'）保护发热，所述印刷电路板包括用于电子电路的带状导体和用于具有至少一个SMD分量和 额外的电子和/或机电零件以适当的方式焊接。 电压供应单元连接到一个或多个供电条导体（2）。 供电带状导体（2）中的至少一个包括通过熔丝桥（6）以导电方式桥接的该端部的断裂，所述熔断器桥（6）包含或由基本材料制成， 其熔点低于制造带状导体的材料的熔点。

公开(公告)号：US10064266B2

公开(公告)日：2018-08-28

申请号：US13185583

申请日：2011-07-19

申请人： Kevin J. Fitzpatrick ,  Ryan K. Roth

发明人： Kevin J. Fitzpatrick ,  Ryan K. Roth

IPC分类号： H01H85/04 ,  H05K1/02 ,  H01H85/46 ,  A47L15/46 ,  H01R12/70

CPC分类号： H05K1/0256 ,  A47L15/46 ,  H01H85/04 ,  H01H85/463 ,  H01R12/7088 ,  H05K1/0263 ,  H05K2201/012 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09872 ,  H05K2201/10181 ,  H05K2201/10189

摘要： A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.

公开(公告)号：US09640357B2

公开(公告)日：2017-05-02

申请号：US14553290

申请日：2014-11-25

申请人： Sony Corporation

发明人： Mitsuo Hashimoto ,  Akira Akiba ,  Hideo Niikura ,  Satoshi Mitani ,  Shinya Morita ,  Kunihiko Saruta

IPC分类号： H01H57/00 ,  H01H85/46 ,  H01H1/00 ,  H01H85/02

CPC分类号： H01H85/463 ,  H01H1/0036 ,  H01H2001/0078 ,  H01H2085/0275

摘要： There is provided an electronic device including a first member formed to include at least a part of a substrate material, a second member formed to include at least a part of the substrate material and configured to be relatively movable with respect to the first member, and a fuse configured to include at least a part of the substrate material and configured to electrically connect the first member to the second member via the substrate material.

公开(公告)号：US20130049679A1

公开(公告)日：2013-02-28

申请号：US13639966

申请日：2011-04-07

申请人： Koichi Mukai ,  Masahiko Ishimaru ,  Takahiro Asada ,  Chisato Komori ,  Shoko Nagaki

发明人： Koichi Mukai ,  Masahiko Ishimaru ,  Takahiro Asada ,  Chisato Komori ,  Shoko Nagaki

IPC分类号： H01H37/74 ,  H01H85/04 ,  H02J7/00

CPC分类号： H02J7/0031 ,  H01H85/046 ,  H01H85/463 ,  H01H2085/0275 ,  H01M10/425 ,  H01M10/4264 ,  H01M10/48 ,  H01M2200/00 ,  H01M2200/10 ,  H01M2200/108

摘要： Heat from a heating resistor is efficiently transmitted to a low-melting-point metal body through a heat transfer path. A protection element, connected onto an electric current path of an electric circuit, is provided with an insulating substrate (60), a heating resistor (64) which is formed on one surface of the insulating substrate (60) with a first insulating layer (62) interposed therebetween, a low-melting-point metal body (67) which is disposed above the heating resistor (64) with a second insulating layer (65) interposed therebetween and constitutes part of the electric current path, and connection portions (611, 612) which are connected to both ends of the low-melting-point metal body (67) and electrically connect the electric current path and the low-melting-point metal body (67), and the connection portions (611, 612) are formed on the surface of the insulating substrate (60) with a first glass layer (70) interposed therebetween.

摘要翻译： 来自加热电阻器的热量通过传热路径有效地传递到低熔点金属体。 连接在电路的电流路径上的保护元件设置有绝缘基板（60），加热电阻（64），其在绝缘基板（60）的一个表面上形成有第一绝缘层（ 62），设置在所述加热电阻体（64）的上方的具有第二绝缘层（65）并构成所述电流通路的一部分的低熔点金属体（67），连接部（611） ，612），其连接到所述低熔点金属体（67）的两端，并且电连接所述电流路径和所述低熔点金属体（67），并且所述连接部（611,612） 在第一玻璃层（70）之间形成在绝缘基板（60）的表面上。