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公开(公告)号：US20190191591A1
公开(公告)日：2019-06-20
申请号：US16284655
申请日：2019-02-25
CPC分类号： H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号：US11520442B1
公开(公告)日：2022-12-06
申请号：US17400461
申请日：2021-08-12
IPC分类号： G06F3/044 , G02F1/1333 , G06F3/041
摘要： A touchscreen for a display device may include a top layer, a bottom layer, and a middle layer between the top layer and the bottom layer. The touchscreen may also include a deposited material that extends around a perimeter of the touchscreen. A length of the deposited material has a length that extends from at least a first portion of the top layer to at least a second portion of the bottom layer. The deposited material may form a seal over the middle layer between the touchscreen and an environment of the display device.
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公开(公告)号：US10912233B2
公开(公告)日：2021-02-02
申请号：US16284655
申请日：2019-02-25
IPC分类号： H05K7/20 , H05K7/14 , H05K1/02 , H01L23/40 , F04D25/06 , F04D25/16 , F04D27/00 , F04D29/60 , H05K7/12
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号：US10754376B1
公开(公告)日：2020-08-25
申请号：US16380500
申请日：2019-04-10
IPC分类号： G06F1/16 , H05K5/00 , G06F3/041 , H05K5/02 , G02F1/1333
摘要： A user interface display device for displaying information associated with an industrial automation system may have a display that has a front face and one or more outer edges, a cover lens optically bonded to the front face of the display with an optical-grade adhesive, and a bezel that has a frame. The frame is disposed about the display, and the bezel defines a gap between the frame and the one or more outer edges of the display. The display device may also have a quantity of gap-filling adhesive disposed at one or more locations within the gap between the one or more outer edges of the display and the frame of the bezel. The quantity of gap-filling adhesive may couple the display to the bezel.
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公开(公告)号：US20180132380A1
公开(公告)日：2018-05-10
申请号：US15720537
申请日：2017-09-29
CPC分类号： H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号：US20220311161A1
公开(公告)日：2022-09-29
申请号：US17213610
申请日：2021-03-26
发明人： Brian T. Estanek , Douglas A. Lostoski , Adam M. Wrobel , Mark S. Williams , John C. Grech , Justin T. Gierke , Sean P. Overberger
摘要： An I/O system including an I/O base, and at least one I/O module mechanically and electrically coupled with the I/O base. The I/O module includes a locking actuator assembly having a locking actuator movable from a first unlocked position to a second locked position, the locking actuator configured to interlock with the I/O base to secure the I/O module to the base when in the second position, and a sensor for sensing a position of the locking actuator and generating a signal indicative of the position of the locking actuator.
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公开(公告)号：US10238004B2
公开(公告)日：2019-03-19
申请号：US15720537
申请日：2017-09-29
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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