-
公开(公告)号：US10912233B2
公开(公告)日：2021-02-02
申请号：US16284655
申请日：2019-02-25
IPC分类号： H05K7/20 , H05K7/14 , H05K1/02 , H01L23/40 , F04D25/06 , F04D25/16 , F04D27/00 , F04D29/60 , H05K7/12
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
-
公开(公告)号：US20180132380A1
公开(公告)日：2018-05-10
申请号：US15720537
申请日：2017-09-29
CPC分类号： H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
-
公开(公告)号：US20190191591A1
公开(公告)日：2019-06-20
申请号：US16284655
申请日：2019-02-25
CPC分类号： H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
-
公开(公告)号：US10238004B2
公开(公告)日：2019-03-19
申请号：US15720537
申请日：2017-09-29
摘要： An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
-
公开(公告)号：US10194514B2
公开(公告)日：2019-01-29
申请号：US14938085
申请日：2015-11-11
摘要： Electrostatic charge grounding is achieved by connecting an outer surface touchscreen conductive coating to a grounded conductor in a graphics terminal using an electrostatic charge routing system that provides a path for electrons that accumulate on the conductive coating to pass through one or more non-conductive elements in the graphics terminal. The grounded conductor can be a bezel made of metal or another conductor, a conductive paint layer applied to a bezel or other graphics terminal element, a metal spline pin or a metal screw. The electron path defined by the electrostatic charge routing system can include conductive and dissipative elements such as metal spline pins, metal screws, conductive epoxy, conducting plastic elements providing a short, closed electron bridge.
-
公开(公告)号：US20170135188A1
公开(公告)日：2017-05-11
申请号：US14938085
申请日：2015-11-11
CPC分类号： H05F3/02 , G02F1/133308 , G02F2202/22 , G06F1/1637 , G06F1/1643 , G06F1/1656 , G06F1/182 , G06F3/041 , H05K9/0067
摘要： Electrostatic charge grounding is achieved by connecting an outer surface touchscreen conductive coating to a grounded conductor in a graphics terminal using an electrostatic charge routing system that provides a path for electrons that accumulate on the conductive coating to pass through one or more non-conductive elements in the graphics terminal. The grounded conductor can be a bezel made of metal or another conductor, a conductive paint layer applied to a bezel or other graphics terminal element, a metal spline pin or a metal screw. The electron path defined by the electrostatic charge routing system can include conductive and dissipative elements such as metal spline pins, metal screws, conductive epoxy, conducting plastic elements providing a short, closed electron bridge.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.013 秒)
