摘要:
There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates.Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers.The novel compositions are photoimageable and are particularly suitable for use as solder resists.
摘要:
The invention relates to mixtures containing:a) a cationically polymerizable compound andb) a compound of the formula I[R.sup.1 (Fe.sup.II R.sup.2).sub.a ].sub.q.sup..sym.an anX.sup..crclbar.q (I)in which a is 1 or 2, n is 1 or 2, R.sup.1 is a substituted or unsubstituted .pi.-arene, R.sup.2 is a substituted or unsubstituted .pi.-arene or cyclopentadienyl anion or indenyl anion, q is an integer from 1 to 3 and X is FSO.sub.3.sup.- or a q-valent anion of an organic sulfonic acid or of a carboxylic acid; R.sup.1 can also be a polymeric, aromatic ligand. The invention also relates to the novel compounds of the formula I. The curable mixtures can be processed in particular for the production of coatings having a good resistance to heat.
摘要:
The invention relates to mixtures containing:(a) cationically polymerizable compound and(b) a compound of the formula I[R.sup.1 (FE.sup.II R.sup.2).sub.a ].sub.q.sup..sym.an an X.sup..crclbar.(I)in which a is 1 or 2, n is 1 or 2, R.sup.1 is a substituted or unsubstituted .pi.-arene, R.sup.2 is a substituted or unsubstituted .pi.-arene or cyclopentadienyl anion or indenyl anion, q is an integer from 1 to 3 and X is FSO.sub.3.sup.- or a q-valent anion of an organic sulfonic acid or of a carobxylic acid; R.sup.1 can also be a polymeric, aromatic ligand. The invention also relates to the novel compounds of the formula I. The curable mixtures can be processed in particular for the production of coatings having a good resistance to heat.